DuPont Electronics & Industrial’s leading-edge portfolio of silicone die attach adhesives delivers proven, dependable bonds for the most demanding chip applications in automotive, communications, consumer electronics, and industrial markets. Well-suited to work with various substrate materials and flexible curing conditions, all our advanced die attach adhesive products enhance the reliability of your electronics by offering:
Additionally, our solvent-less line of die attach silicones are environmentally responsible and cure at a range of temperatures - further reducing thermal stress and energy consumption. All materials in this product family are one-part silicones and can be processed using standard microelectronics equipment.
Die attach adhesives are used to attach semiconductor chips to packaging substrates. In addition to forming the attachment, they can help mitigate stress and control warpage during system operation. Some die attach adhesives are formulated to be both thermally conductive and electrically insulating.
DuPont’s selection of die attach solutions offers versatile options for superior chip design. Materials are designed to provide flexible curing conditions and optimized rheological properties for ease of application, and ensure strong adhesion with various substrate surfaces with different coefficients of thermal expansion.
Ordinary die-attach adhesives suit ordinary chip applications. But when a chip design must deliver reliable performance in extreme temperatures, high moisture, or stressful environments look to DuPont Electronics & Industrial for extraordinary solutions.
DuPont’s portfolio of silicone-based lid-seal adhesives are designed to handle the high functionality of today’s advanced packaging processes, delivering the performance needed for today’s high-performance computing, mobile and automotive electronic applications.
Our thermally conductive silicones are designed to handle the heat dissipation of today’s advanced electronic devices.
Our silicone die encapsulants maintain reliable performance even at the high reflow temperatures required for lead-free solder processing or stringent thermal stress-reliability testing conditions.
Photo-patternable dielectrics and non-photo-patternable adhesives make possible chip-to-wafer and wafer-to-wafer stacking for heterogeneous integration.