DuPont Electronics & Imaging’s family of adhesives and dielectrics provide leading-edge permanent bonding materials solutions to meet key requirements for today’s high-density, thinner packages used in mobile products and high-performance computing.
DuPont Electronics & Imaging’s permanent bonding materials for 3DICs, memory stacks, image sensors, and MEMS applications:
Permanent bonding materials are adhesives and dielectrics used to assemble IC logic chips, memory chips, image sensor devices, microelectromechanical systems (MEMS) devices, and more into high-density heterogeneously-integrated packages. These high-density, ultra-thin electronic packages are needed for artificial intelligence (AI) in high-performance computers, data centers, 5G, and high-end mobile products.
When building today's high-density, thinner electronics packages, semiconductor device manufacturers rely on permanent bonding materials for stacking chips using either chip-to-wafer or wafer-to-wafer stacking processes
DuPont’s portfolio of silicone-based lid-seal adhesives are designed to handle the high functionality of today’s advanced packaging processes, delivering the performance needed for today’s high-performance computing, mobile and automotive electronic applications.
Our thermally conductive silicones are designed to handle the heat dissipation of today’s advanced electronic devices.View Details
Ordinary die-attach adhesives suit ordinary chip applications. But when a chip design must deliver reliable performance in extreme temperatures, high moisture, or stressful environments look to DuPont Electronics & Imaging for extraordinary solutions.View Details
Our silicone die encapsulants maintain reliable performance even at the high reflow temperatures required for lead-free solder processing or stringent thermal stress-reliability testing conditions.View Details
Photo-patternable dielectrics and non-photo-patternable adhesives make possible chip-to-wafer and wafer-to-wafer stacking for heterogeneous integration.View Details