With production-proven metallization processes for high- and low-speed plating, DuPont Electronics & Imaging’s copper pillar products meet the strict requirements for today’s fine-pitch Cu pillar, Cu stud, and Cu µpillar processes used in advanced wafer-level packaging architectures, from flip-chip processes, to 2.5D and 3D integration schemes. Its additives and high-purity formulation address a wide process window, and are designed to work in perfect harmony with our under-bump metallization (UBM) and tin-silver capping chemistries to provide a seamless solution.
DuPont Electronics & Imaging Cu plating chemistries’ stand-out features include:
Copper (Cu) pillars offer a finer-pitch alternative to solder bumps to form interconnects between the chip and the package substrate, interposer, or other chips in 3D integration schemes. They are fabricated on top of under bump metallization (UBM) using photolithography and deposition processes and are capped with tin-silver to form the electronic interconnect.
As pitch requirements continue to shrink, copper pillars can enable higher-density designs while maintaining consistent bump heights. The next-generation technology will feature pillars as narrow as 10 to 30 µm. DuPont Electronics & Imaging’s Cu plating chemistries are designed to be ultra-pure and balanced to deliver the optimal intermetallic layer at the interface and void-free pillars at consistent heights.
DuPont delivers a full portfolio of packaging and assembly materials for the semiconductor industry. Click here to view a short video of our comprehensive offerings.
Our production-proven Cu pillar formulations work in perfect harmony with our under-bump metallization (UBM) and tin-silver capping chemistries, to provide a seamless solution for all your Cu pillar needs.
DuPont Electronics & Imaging copper chemistries for redistribution layers (RDLs) are ideally suited to today’s high-density requirements for wafer level packaging applications.
DuPont’s award-winning Solderon™ BP electroplating chemistries are a reliable alternative to tin-lead alloys for all wafer bumping applications.
We offer a production-proven electroplating nickel chemistry tailored to meet a variety of UBM process needs
DuPont offers positive- and negative-tone photoresists designed to meet the tight pitches and varied topographies of today’s semiconductor advanced packaging applications.
Years of experience and success in electroplating damascene copper have helped DuPont bring leading-edge copper TSV chemistries to the advanced packaging market.
Look to DuPont for packaging dielectric formulations that have the mechanical properties, high resolution, low-temp curing, easy processes, and superior reliability needed to protect your advanced WLP.
We love to talk about how our electronics solutions can build business, commercialize products,
and solve the challenges of our time.