DuPont Electronics & Industrial offers a production-proven nickel plating chemistry that is ideal for under bump metallization (UBM). This product is formulated to meet the wide variety of customer needs for uniform deposits, excellent barrier capabilities, solderability, and other characteristics that are essential for consistent wafer fabrication.
Under bump metallization – or UBM – is an advanced packaging process that involves creating a thin film metal layer stack between the integrated circuit (IC) or copper pillars and solder bumps in a flip chip package. Critical to package reliability, the stack serves 3 purposes:
We offer a production-proven electroplating nickel chemistry tailored to meet a variety of UBM process needs
Our production-proven Cu pillar formulations work in perfect harmony with our under-bump metallization (UBM) and tin-silver capping chemistries, to provide a seamless solution for all your Cu pillar needs.
DuPont’s award-winning Solderon™ BP electroplating chemistries are a reliable alternative to tin-lead alloys for all wafer bumping applications.
DuPont Electronics & Imaging copper chemistries for redistribution layers (RDLs) are ideally suited to today’s high-density requirements for wafer level packaging applications.
DuPont offers positive- and negative-tone photoresists designed to meet the tight pitches and varied topographies of today’s semiconductor advanced packaging applications.
Years of experience and success in electroplating damascene copper have helped DuPont bring leading-edge copper TSV chemistries to the advanced packaging market.
Look to DuPont for packaging dielectric formulations that have the mechanical properties, high resolution, low-temp curing, easy processes, and superior reliability needed to protect your advanced WLP.