Copper Redistribution Layer

Copper (Cu) RDL is an interconnect technology used in both fan-in and fan-out wafer level processing. It allows high-density I/Os to be redistributed for connection to the circuit board by increasing the pitch.

Additionally, the purity of the Cu formulation reduces manufacturing costs by eliminating the nickel barrier between the copper and solder elements required by other plating approaches to control topography and eliminate defects.

Driven by mobile applications that require increased functionality at lower power, RDL requirements are tightening from 5 µm line/space to 2 µm line/space. This calls for plating chemistries that can achieve high reliability with low-within-die uniformity.

The function of additives in RDL plating is similar to those in Cu pillar plating. DuPont’s INTERVIA™ 9000 plating chemistry can be used for both RDL and Cu pillar plating in one plating tool without changing the plating bath, making it an economical choice.

DuPont delivers a full portfolio of packaging and assembly materials for the semiconductor industry. Click here to view a short video of our comprehensive offerings.

Copper Redistribution Layer

DuPont Electronics & Imaging copper chemistries for redistribution layers (RDLs) are ideally suited to today’s high-density requirements for wafer level packaging applications.

Copper Pillar Plating

Our production-proven Cu pillar formulations work in perfect harmony with our under-bump metallization (UBM) and tin-silver capping chemistries, to provide a seamless solution for all your Cu pillar needs.

Solder Bump Plating

DuPont’s award-winning Solderon™ BP electroplating chemistries are a reliable alternative to tin-lead alloys for all wafer bumping applications.

Under Bump Metallization

We offer a production-proven electroplating nickel chemistry tailored to meet a variety of UBM process needs

Bump Plating Photoresists

DuPont offers positive- and negative-tone photoresists designed to meet the tight pitches and varied topographies of today’s semiconductor advanced packaging applications.

Through Silicon Via Copper

Years of experience and success in electroplating damascene copper have helped DuPont bring leading-edge copper TSV chemistries to the advanced packaging market.

Packaging Dielectrics

Look to DuPont for packaging dielectric formulations that have the mechanical properties, high resolution, low-temp curing, easy processes, and superior reliability needed to protect your advanced WLP.