DuPont Electronics & Industrial’s line of packaging dielectrics protect today’s high-performance IC chips from physical, chemical, and electrical damage by insulating distribution wiring from the chip to the package substrate to the circuit board.
Designed to meet the demands of advanced wafer level packaging (WLP) architectures for both passivation and redistribution layer applications, our BCB-based CYCLOTENE™ and epoxy-based INTERVIA™ dielectric materials provide:
Our patented, advanced formulations give you:
Look to DuPont for packaging dielectric formulations that have the mechanical properties, high resolution, low-temp curing, easy processes, and superior reliability needed to protect your advanced WLP.
Our production-proven Cu pillar formulations work in perfect harmony with our under-bump metallization (UBM) and tin-silver capping chemistries, to provide a seamless solution for all your Cu pillar needs.
DuPont’s award-winning Solderon™ BP electroplating chemistries are a reliable alternative to tin-lead alloys for all wafer bumping applications.
We offer a production-proven electroplating nickel chemistry tailored to meet a variety of UBM process needs
DuPont offers positive- and negative-tone photoresists designed to meet the tight pitches and varied topographies of today’s semiconductor advanced packaging applications.
Years of experience and success in electroplating damascene copper have helped DuPont bring leading-edge copper TSV chemistries to the advanced packaging market.
DuPont Electronics & Imaging copper chemistries for redistribution layers (RDLs) are ideally suited to today’s high-density requirements for wafer level packaging applications.