Laminates/Coverlays/Bondplys & Adhesives

Thin Copper Clad Laminate


Interra® Thin Copper Clad Laminates for Embedded Capacitance

DuPont™ Interra® thin copper clad laminates are specifically designed for use as embedded capacitance materials in multilayer rigid printed circuit boards. They offer the best mechanical strength, reliability and capacitance stability on the market.

By utilizing Interra® laminates between the power and ground planes in a Power Distribution Network (PDN), designers can reduce the modal resonances and lower the inductance between the power and ground planes. This has the effect of reducing the impedance in the system and decreasing the number of required surface mount capacitors.

All Interra® thin copper clad laminates utilize low-profile electrodeposited (ED) copper laminated to thin polyimide based dielectric.  This dielectric is engineered to have superior adhesion to copper than traditional glass-reinforced materials utilized in rigid boards.  The polyimide dielectric is based on DuPont™ Kapton® technology, but is specifically engineered to have low dielectric loss, high dielectric isolation and strength, and tight thickness tolerance.

Laminate Product Selector

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Laminate Materials For PCBs

  • Thin Copper Clad Laminate

    Thin Copper Clad Laminate

    Interra® thin copper clad laminates for embedded capacitance.

    DuPont™ Interra® embedded planar capacitor laminate is used to make thinner, more efficient power and ground planes within a multilayer printed wiring board.

    Interra® HK04M is DuPont’s next generation embedded capacitance laminate, which has been optimized to handle thinner dielectric layers and further reduce the impedance between power and ground planes in a printed wiring board.
  • All-Polyimide Solutions

    All-Polyimide Solutions

    DuPont adhesiveless all polyimide copper clad flexible laminates (CCL) are available in a wide variety of copper types, thicknesses and construction options.


    DuPont™ Pyralux® APR is an all polyimide double sided resistor laminate ideal for advanced applications in military, aerospace, automotive and consumer electronics markets, where reliable embedded resistor technology, temperature tolerance, and robust processing are required.

    DuPont™ Pyralux® AC is an all polyimide single sided copper clad laminate ideal for applications that require thin, light and high density circuitry along with chip-on-flex attachment.

    DuPont™ Pyralux® AG is an all-polyimide double sided copper clad laminate that is offered in both sheets and rolls with global availability and is ideal for use in high volume consumer, medical and automotive applications.

    DuPont™ Pyralux® AP is an all polyimide double sided copper clad laminate that has excellent thermal, chemical and mechanical properties ideal for use in high reliability flex and multilayer flex circuitry.

    Pyralux® HT is an all polyimide bonding film with the highest service temperature available today and low loss performance when paired with Pyralux® AP.

    DuPont™ Pyralux® TA series are all polyimide copper clad laminates designed for high speed high frequency applications. Paired offerings of double sided and single sided clads enable multi-layer construction of antenna and feedlines with good material compatibility

  • Epoxy Adhesive Solutions

    Epoxy Adhesive Solutions

    Our family of epoxy-based adhesive solutions offers superior peel strength, chemical, and heat resistance.


    Pyralux® GPL Sheet Adhesive is a proprietary B-staged modified epoxy adhesive and is primarily utilized to bond flexible inner layers or rigid cap layers in flexible and rigid-flex constructions..

    DuPont™ Pyralux® HP is an epoxy-based adhesive system demonstrating both low loss and high reliability, specifically designed for OEMs and PCB design manufacturers.

    DuPont™ Pyralux® HXC is DuPont™ Kapton® MBC black polyimide film coated with epoxy ideal for products where uniform matte black appearance is desired.

    DuPont™ Pyralux® HXI is DuPont™ Kapton® black polyimide film coated with epoxy ideal for products where uniform matte black appearance is desired. It offers thinner construction than Pyralux® HXC, but similar mechanical and process properties.
  • Fluoropolymer Adhesive Solutions

    Fluoropolymer Adhesive Solutions

    DuPont’s family of fluoropolymer adhesive solutions delivers superior performance in high-speed and high frequency applications.


    DuPont™ Pyralux® TK is a fluoropolymer/polyimide composite double sided copper clad laminate and bondply ideal for high speed digital and high frequency flexible circuit applications.
  • Acrylic-based Adhesive Solutions

    Acrylic-based Adhesive Solutions

    Superior bond strength and flexibility for high volume applications


    DuPont™ Pyralux® FR products are acrylic-based flame retardant copper clad laminates, coverlays, bonpdplys and sheet adhesives for products requiring UL rating.

    DuPont™ Pyralux® LF products are acrylic-based copper clad laminates, coverlays, bondplys and sheet adhesives and have been the industry standard in high reliability applications in the consumer electronics industry for over 35 years with a proven record of consistency and dependability.

    DuPont™ Pyralux® LF-B is DuPont™ Kapton® B black polyimide film coated with acrylic ideal for products where uniform matte black appearance is desired.