Laminates/Coverlays/Bondplys & Adhesives

Thin Copper Clad Laminate

Innovative Thin Copper Clad Laminates Push Electrical Boundaries

DuPont™ Interra™ thin copper clad laminates are specifically designed for use in multilayer rigid printed circuit boards.

All Interra™ thin copper clad laminates utilize low-profile electrodeposited (ED) copper laminated to thin polyimide based dielectric.  This dielectric is engineered to have superior adhesion to copper than traditional glass-reinforced materials utilized in rigid boards.  The polyimide dielectric is based on DuPont™ Kapton® technology, but is specifically engineered to have low dielectric loss, high dielectric isolation and strength, and tight thickness tolerance which are inherent benefits compared to traditional rigid circuit board materials.

Laminate Product Selector

Find the best product for your application.

Laminate Materials For PCBs

  • Thin Copper Clad Laminate
  • All-Polyimide Solutions
  • Epoxy Adhesive Solutions
  • Fluoropolymer Adhesive Solutions
  • Acrylic-based Adhesive Solutions

Thin Copper Clad Laminate

Interra® thin copper clad laminates for embedded capacitance.

Interra™ HK04J

DuPont™ Interra™ embedded planar capacitor laminate is used to make thinner, more efficient power and ground planes within a multilayer printed wiring board.


All-Polyimide Solutions

DuPont adhesiveless all polyimide copper clad flexible laminates (CCL) are available in a wide variety of copper types, thicknesses and construction options.

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Pyralux® APR

DuPont™ Pyralux® APR is an all polyimide double sided resistor laminate ideal for advanced applications in military, aerospace, automotive and consumer electronics markets, where reliable embedded resistor technology, temperature tolerance, and robust processing are required.

Pyralux® AC

DuPont™ Pyralux® AC is an all polyimide single sided copper clad laminate ideal for applications that require thin, light and high density circuitry along with chip-on-flex attachment.

Pyralux® AP

DuPont™ Pyralux® AP is an all polyimide double sided copper clad laminate that has excellent thermal, chemical and mechanical properties ideal for use in high reliability flex and multilayer flex circuitry.

Pyralux® HT

Pyralux® HT is an all polyimide bonding film with the highest service temperature available today and low loss performance when paired with Pyralux® AP.


Epoxy Adhesive Solutions

Our family of epoxy-based adhesive solutions offers superior peel strength, chemical, and heat resistance.

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Pyralux® HXC

DuPont™ Pyralux® HXC is DuPont™ Kapton® MBC black polyimide film coated with epoxy ideal for products where uniform matte black appearance is desired.


Fluoropolymer Adhesive Solutions

DuPont’s family of fluoropolymer adhesive solutions delivers superior performance in high-speed and high frequency applications.

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Pyralux® TK

DuPont™ Pyralux® TK is a fluoropolymer/polyimide composite double sided copper clad laminate and bondply ideal for high speed digital and high frequency flexible circuit applications.


Acrylic-based Adhesive Solutions

Superior bond strength and flexibility for high volume applications

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Pyralux® FR

DuPont™ Pyralux® FR products are acrylic-based flame retardant copper clad laminates, coverlays, bonpdplys and sheet adhesives for products requiring UL rating.

Pyralux® LF

DuPont™ Pyralux® LF products are acrylic-based copper clad laminates, coverlays, bondplys and sheet adhesives and have been the industry standard in high reliability applications for over 35 years with a proven record of consistency and dependability.

Pyralux® LF-B

DuPont™ Pyralux® LF-B is DuPont™ Kapton® B black polyimide film coated with acrylic ideal for products where uniform matte black appearance is desired.