Semiconductor Packaging Materials

Packaging Dielectrics


Designed to Protect High-Performance IC Chips

DuPont Electronics & Imaging’s line of packaging dielectrics protect today’s high-performance IC chips from physical, chemical, and electrical damage by insulating distribution wiring from the chip to the package substrate to the circuit board.

Designed to meet the demands of advanced wafer level packaging (WLP) architectures for both passivation and redistribution layer applications, our BCB-based Cyclotene™ and epoxy-based Intervia™ dielectric materials provide:

  • Low cure temperature
  • Low loss
  • Good thermal stability
  • Chemical resistance
  • Good optical properties
  • Platform to invent new materials

Our patented, advanced formulations give you:

  • Higher throughput
  • Improved device reliability
  • High resolution
  • The capability to meet performance requirements of high-end devices

Product lines:

  • Intervia™ Photodielectric
  • Cyclotene™ 3000 Series Advanced Electronic Resins
  • Cyclotene™ 4000 series Advanced Electronic Resins
  • Cyclotene™ 6000 series Advanced Electronic Resins

Semiconductor Packaging Materials

  • Packaging Dielectrics

    Packaging Dielectrics

    Look to DuPont for packaging dielectric formulations that have the mechanical properties, high resolution, low-temp curing, easy processes, and superior reliability needed to protect your advanced WLP.

  • Copper Pillar Plating

    Copper Pillar Plating

    Our production-proven Cu pillar formulations work in perfect harmony with our under-bump metallization (UBM) and tin-silver capping chemistries, to provide a seamless solution for all your Cu pillar needs.

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  • Solder Bump Plating

    Solder Bump Plating

    DuPont’s award-winning Solderon™ BP electroplating chemistries are a reliable alternative to tin-lead alloys for all wafer bumping applications.

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    Indium plating chemistry designed for low-temperature solder plating processes used in advanced wafer-level packaging for emerging applications that are sensitive to temperature.

    HVM-proven tin-silver plating chemistry for lead-free, fine-pitch solder bump applications with industry-leading process versatility.
  • Under Bump Metallization

    Under Bump Metallization

    We offer a production-proven electroplating nickel chemistry tailored to meet a variety of UBM process needs

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  • Bump Plating Photoresists

    Bump Plating Photoresists

    DuPont offers positive- and negative-tone photoresists designed to meet the tight pitches and varied topographies of today’s semiconductor advanced packaging applications.

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    Wafer-level packaging dry-film photoresist solutions for 3DIC, fan out, bumping, copper pillar and redistribution applications.

    DuPont offers liquid bump plating photoresists, along with associated ancillaries, that are ideally suited for wafer-level packaging applications using single-spin coating.
  • Through Silicon Via Copper

    Through Silicon Via Copper

    Years of experience and success in electroplating damascene copper have helped DuPont bring leading-edge copper TSV chemistries to the advanced packaging market.

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  • Copper Redistribution Layer

    Copper Redistribution Layer

    DuPont Electronics & Imaging copper chemistries for redistribution layers (RDLs) are ideally suited to today’s high-density requirements for wafer level packaging applications.

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