Semiconductor Packaging Materials

Under Bump Metallization

 
 
 

Production-Proven Nickel Plating Chemistry

DuPont Electronics & Imaging offers a production-proven nickel plating chemistry that is ideal for under bump metallization (UBM). This product is formulated to meet the wide variety of customer needs for uniform deposits, excellent barrier capabilities, solderability, and other characteristics that are essential for consistent wafer fabrication.

Products:

  • Nikal BP Chemistry
 
 
 
  • Under bump metallization – or UBM – is an advanced packaging process that involves creating a thin film metal layer stack between the integrated circuit (IC) or copper pillars and solder bumps in a flip chip package. Critical to package reliability, the stack serves 3 purposes:

    • It forms the electrical connection between the die and the bump
    • It serves as a barrier to eliminate unwanted diffusion
    • It creates the mechanical connection between the bump and the bump pad
  • DuPont delivers a full portfolio of packaging and assembly materials for the semiconductor industry. Click here to view a short video of our comprehensive offerings.

Semiconductor Packaging Materials

  • Under Bump Metallization

    Under Bump Metallization

    We offer a production-proven electroplating nickel chemistry tailored to meet a variety of UBM process needs

  • Copper Pillar Plating

    Copper Pillar Plating

    Our production-proven Cu pillar formulations work in perfect harmony with our under-bump metallization (UBM) and tin-silver capping chemistries, to provide a seamless solution for all your Cu pillar needs.

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  • Solder Bump Plating

    Solder Bump Plating

    DuPont’s award-winning Solderon™ BP electroplating chemistries are a reliable alternative to tin-lead alloys for all wafer bumping applications.

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    Indium plating chemistry designed for low-temperature solder plating processes used in advanced wafer-level packaging for emerging applications that are sensitive to temperature.

    HVM-proven tin-silver plating chemistry for lead-free, fine-pitch solder bump applications with industry-leading process versatility.
     
     
     
  • Copper Redistribution Layer

    Copper Redistribution Layer

    DuPont Electronics & Imaging copper chemistries for redistribution layers (RDLs) are ideally suited to today’s high-density requirements for wafer level packaging applications.

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  • Bump Plating Photoresists

    Bump Plating Photoresists

    DuPont offers positive- and negative-tone photoresists designed to meet the tight pitches and varied topographies of today’s semiconductor advanced packaging applications.

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    Wafer-level packaging dry-film photoresist solutions for 3DIC, fan out, bumping, copper pillar and redistribution applications.

    DuPont offers liquid bump plating photoresists, along with associated ancillaries, that are ideally suited for wafer-level packaging applications using single-spin coating.
  • Through Silicon Via Copper

    Through Silicon Via Copper

    Years of experience and success in electroplating damascene copper have helped DuPont bring leading-edge copper TSV chemistries to the advanced packaging market.

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  • Packaging Dielectrics

    Packaging Dielectrics

    Look to DuPont for packaging dielectric formulations that have the mechanical properties, high resolution, low-temp curing, easy processes, and superior reliability needed to protect your advanced WLP.

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