Semiconductor Packaging Materials

Under Bump Metallization

Production-Proven Nickel Plating Chemistry

DuPont Electronics & Imaging offers a production-proven nickel plating chemistry that is ideal for under bump metallization (UBM). This product is formulated to meet the wide variety of customer needs for uniform deposits, excellent barrier capabilities, solderability, and other characteristics that are essential for consistent wafer fabrication.


  • Nikal BP Chemistry
  • Under bump metallization – or UBM – is an advanced packaging process that involves creating a thin film metal layer stack between the integrated circuit (IC) or copper pillars and solder bumps in a flip chip package. Critical to package reliability, the stack serves 3 purposes:

    • It forms the electrical connection between the die and the bump
    • It serves as a barrier to eliminate unwanted diffusion
    • It creates the mechanical connection between the bump and the bump pad

Semiconductor Packaging Materials

  • Under Bump Metallization
  • Copper Pillar Plating
  • Solder Bump Plating
  • Copper Redistribution Layer
  • Bump Plating Photoresists
  • Through Silicon Via Copper
  • Packaging Dielectrics

Under Bump Metallization

We offer a production-proven electroplating nickel chemistry tailored to meet a variety of UBM process needs

Copper Pillar Plating

Our production-proven Cu pillar formulations work in perfect harmony with our under-bump metallization (UBM) and tin-silver capping chemistries, to provide a seamless solution for all your Cu pillar needs.

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Solder Bump Plating

DuPont’s award-winning Solderon™ BP electroplating chemistries are a reliable alternative to tin-lead alloys for all wafer bumping applications.

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Solderon™ BP 1000 Indium Chemistry

Indium plating chemistry designed for low-temperature solder plating processes used in advanced wafer-level packaging for emerging applications that are sensitive to temperature.

Solderon™ BP TS 6000 Tin-Silver Plating Chemistry

HVM-proven tin-silver plating chemistry for lead-free, fine-pitch solder bump applications with industry-leading process versatility.

Copper Redistribution Layer

DuPont Electronics & Imaging copper chemistries for redistribution layers (RDLs) are ideally suited to today’s high-density requirements for wafer level packaging applications.

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Bump Plating Photoresists

DuPont offers positive- and negative-tone photoresists designed to meet the tight pitches and varied topographies of today’s semiconductor advanced packaging applications.

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Dry Film Photoresists for WLP

Wafer-level packaging dry-film photoresist solutions for 3DIC, fan out, bumping, copper pillar and redistribution applications.

Liquid Photoresists

DuPont offers liquid bump plating photoresists, along with associated ancillaries, that are ideally suited for wafer-level packaging applications using single-spin coating.

Through Silicon Via Copper

Years of experience and success in electroplating damascene copper have helped DuPont bring leading-edge copper TSV chemistries to the advanced packaging market.

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Packaging Dielectrics

Look to DuPont for packaging dielectric formulations that have the mechanical properties, high resolution, low-temp curing, easy processes, and superior reliability needed to protect your advanced WLP.

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