Under Bump Metallization

Dow Electronic Materials offers a range of electroless plating chemistries, including nickel, zincate, immersion gold and palladium, that are ideal for under bump metallization (UBM). These products are formulated to meet the wide variety of customer needs for uniform deposits, high wear resistance, high hardness, porosity control, solderability and other characteristics that are essential for consistent wafer fabrication.

NIKAL™ BP Nickel Chemistry