Interra® HK04M Embedded Capacitance Laminate
Interra® HK04M embedded capacitance laminate is used between the power and ground planes within a multilayer printed wiring board.
Interra® HK04M provides very low impedance at high frequency, power bus decoupling, and electromagnetic interference reduction. It replaces surface mount by-pass capacitors and their plated-through-holes, which improves the reliability, design flexibility, packaging size and cost of the PWB.
Interra® HK04M is an all-polyimide dielectric laminate that offers the best mechanical properties, reliability and capacitance stability on the market. It can be processed as a thin flexible circuit laminate through the develop/etch/strip process steps. The HK04M dielectric is flexible and can be imaged and etched to remove copper on both sides of the dielectric at the same time.
- High speed multilayer printed wiring boards
- Servers, routers, telecom
- Military and Aerospace PWBs
- Graphics Processing Units (GPU)
- PWB's with >4 SMT By-Pass Capacitors per square inch
Benefits of Embedded Capacitance
- Cost reduction by reducing surface mount capacitors and their plated-through-holes
- Reduced inductance for efficient low noise power delivery
- Reduced board size and layer count
- Improved circuit design
- Improved PWB reliability and toughness
- Higher processing yield
Features of Interra® HK04M
- Modified polyimide core to handle thinner dielectric layer (12 μm and less)
- Homogeneous, all-polyimide dielectric layer that will not delaminate during processing
- High initiation and propagation tear strengths contribute to superior handling
- Proven high reliability under extreme conditions
- Excellent capacitance stability over range of frequencies, temperatures and voltages
- Available with ½ oz (18 μm), 1 oz (35 μm) and 2 oz (70 μm) copper thicknesses in balanced and unbalanced constructions
- Offered with IPC 4562 Grade 3 reverse treated electrodeposited copper. VLP and rolled annealed copper is available upon request
- Available with ½ and 1 mil dielectric thicknesses. 1/3 mil (8 μm) thickness under development.