Acrylic-based Adhesive Solutions

Pyralux® Acrylic-based Adhesive Solutions

DuPont offers a complete line of acrylic-based adhesive systems that offer superior bond strength and flexibility in high volume applications.

Many standard and customized constructions of core dielectric, adhesive, and copper thicknesses are available to meet today's demanding design requirements requiring multiple high-temperature lamination cycles.

Laminate Product Selector

Find the best product for your application.

Laminate Materials For PCBs

  • Acrylic-based Adhesive Solutions
  • All-Polyimide Solutions
  • Epoxy Adhesive Solutions
  • Fluoropolymer Adhesive Solutions
  • Thin Copper Clad Laminate

Acrylic-based Adhesive Solutions

Superior bond strength and flexibility for high volume applications

Pyralux® FR

DuPont™ Pyralux® FR products are acrylic-based flame retardant copper clad laminates, coverlays, bonpdplys and sheet adhesives for products requiring UL rating.

Pyralux® LF

DuPont™ Pyralux® LF products are acrylic-based copper clad laminates, coverlays, bondplys and sheet adhesives and have been the industry standard in high reliability applications for over 35 years with a proven record of consistency and dependability.

Pyralux® LF-B

DuPont™ Pyralux® LF-B is DuPont™ Kapton® B black polyimide film coated with acrylic ideal for products where uniform matte black appearance is desired.

All-Polyimide Solutions

DuPont adhesiveless all polyimide copper clad flexible laminates (CCL) are available in a wide variety of copper types, thicknesses and construction options.

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Pyralux® APR

DuPont™ Pyralux® APR is an all polyimide double sided resistor laminate ideal for advanced applications in military, aerospace, automotive and consumer electronics markets, where reliable embedded resistor technology, temperature tolerance, and robust processing are required.

Pyralux® AC

DuPont™ Pyralux® AC is an all polyimide single sided copper clad laminate ideal for applications that require thin, light and high density circuitry along with chip-on-flex attachment.

Pyralux® AP

DuPont™ Pyralux® AP is an all polyimide double sided copper clad laminate that has excellent thermal, chemical and mechanical properties ideal for use in high reliability flex and multilayer flex circuitry.

Pyralux® HT

Pyralux® HT is an all polyimide bonding film with the highest service temperature available today and low loss performance when paired with Pyralux® AP.

Epoxy Adhesive Solutions

Our family of epoxy-based adhesive solutions offers superior peel strength, chemical, and heat resistance.

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Pyralux® HXC

DuPont™ Pyralux® HXC is DuPont™ Kapton® MBC black polyimide film coated with epoxy ideal for products where uniform matte black appearance is desired.

Fluoropolymer Adhesive Solutions

DuPont’s family of fluoropolymer adhesive solutions delivers superior performance in high-speed and high frequency applications.

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Pyralux® TK

DuPont™ Pyralux® TK is a fluoropolymer/polyimide composite double sided copper clad laminate and bondply ideal for high speed digital and high frequency flexible circuit applications.

Thin Copper Clad Laminate

Interra® thin copper clad laminates for embedded capacitance.

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Interra™ HK04J

DuPont™ Interra™ embedded planar capacitor laminate is used to make thinner, more efficient power and ground planes within a multilayer printed wiring board.