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Production-proven Electroplating Chemistries for Wafer Level Packaging
DuPont Electronics and Imaging’s award-winning Solderon™ BP electroplating chemistries are reliable alternatives to tin-lead alloys for all wafer bumping applications, from standard C4 solder bumps to capping fine-pitch Cu µpillars.
Our lead-free, single-step plating materials are specifically designed for the most challenging advanced wafer-level packaging applications. A variety of formulations including tin-silver alloys, pure tin, and indium materials meet a range of process temperatures and melting points, suiting both high- and low-temperature processing needs. Designed to overcome our customers’ most difficult challenges, such as voiding and throughput, Solderon™ products feature:
- High-speed plating capabilities
- Good surface morphology
- Excellent thickness uniformity
- A wide process window
DuPont Electronics & Imaging leads the way with low-alpha materials by offering tin with low-alpha-particle-emitting versions of our products, which are ideal for packaging applications sensitive to the effects of these emissions.
- Solderon™ BP 1000 Indium Chemistry
- Solderon™ BP TS 6000 Tin-Silver Plating Chemistry
- DuPont Wins Bronze Edison Award for Solderon™ Tin-Silver Plating Chemistry
- DuPont Wins Prestigious R&D 100 Award for Solderon™ Tin-Silver Plating Chemistry
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What is Solder Bumping?
Solder bumps form the electronic interconnect between a chip and its substrate. In wafer level packaging processes, bumps range in size and shape from standard C4 bumps, to solder caps on Cu pillars and µpillars.
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Designed for Lead-free Bumping, Capping
Solder bumps form the electronic interconnect between a chip and its substrate. In wafer level packaging processes, bumps range in size and shape from standard C4 bumps, to solder caps on Cu pillars and µpillars.
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Our Semiconductor Packaging Portfolio
DuPont delivers a full portfolio of packaging and assembly materials for the semiconductor industry. Click here to view a short video of our comprehensive offerings.
Semiconductor Packaging Materials
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Solder Bump Plating
Solder Bump Plating
DuPont’s award-winning Solderon™ BP electroplating chemistries are a reliable alternative to tin-lead alloys for all wafer bumping applications.
Indium plating chemistry designed for low-temperature solder plating processes used in advanced wafer-level packaging for emerging applications that are sensitive to temperature.HVM-proven tin-silver plating chemistry for lead-free, fine-pitch solder bump applications with industry-leading process versatility. -
Copper Pillar Plating
Copper Pillar Plating
Our production-proven Cu pillar formulations work in perfect harmony with our under-bump metallization (UBM) and tin-silver capping chemistries, to provide a seamless solution for all your Cu pillar needs.
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Copper Redistribution Layer
Copper Redistribution Layer
DuPont Electronics & Imaging copper chemistries for redistribution layers (RDLs) are ideally suited to today’s high-density requirements for wafer level packaging applications.
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Under Bump Metallization
Under Bump Metallization
We offer a production-proven electroplating nickel chemistry tailored to meet a variety of UBM process needs
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Bump Plating Photoresists
Bump Plating Photoresists
DuPont offers positive- and negative-tone photoresists designed to meet the tight pitches and varied topographies of today’s semiconductor advanced packaging applications.
View DetailsWafer-level packaging dry-film photoresist solutions for 3DIC, fan out, bumping, copper pillar and redistribution applications.DuPont offers liquid bump plating photoresists, along with associated ancillaries, that are ideally suited for wafer-level packaging applications using single-spin coating. -
Through Silicon Via Copper
Through Silicon Via Copper
Years of experience and success in electroplating damascene copper have helped DuPont bring leading-edge copper TSV chemistries to the advanced packaging market.
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Packaging Dielectrics
Packaging Dielectrics
Look to DuPont for packaging dielectric formulations that have the mechanical properties, high resolution, low-temp curing, easy processes, and superior reliability needed to protect your advanced WLP.
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