Semiconductor Packaging Materials

Solder Bump Plating


Production-proven Electroplating Chemistries for Wafer Level Packaging

DuPont Electronics and Imaging’s award-winning Solderon™ BP electroplating chemistries are reliable alternatives to tin-lead alloys for all wafer bumping applications, from standard C4 solder bumps to capping fine-pitch Cu µpillars.

Our lead-free, single-step plating materials are specifically designed for the most challenging advanced wafer-level packaging applications. A variety of formulations including tin-silver alloys, pure tin, and indium materials meet a range of process temperatures and melting points, suiting both high- and low-temperature processing needs. Designed to overcome our customers’ most difficult challenges, such as voiding and throughput, Solderon™ products feature:

  • High-speed plating capabilities
  • Good surface morphology
  • Excellent thickness uniformity
  • A wide process window

DuPont Electronics & Imaging leads the way with low-alpha materials by offering tin with low-alpha-particle-emitting versions of our products, which are ideal for packaging applications sensitive to the effects of these emissions.

  • Solder bumps form the electronic interconnect between a chip and its substrate. In wafer level packaging processes, bumps range in size and shape from standard C4 bumps, to solder caps on Cu pillars and µpillars.

  • Environmental requirements are limiting the use of lead in solders. Additionally, different devices and manufacturing processes need to withstand both low and high temperatures. With this in mind, DuPont Electronics & Imaging has developed tin-silver, pure tin and indium formulations to enable a variety of lead-free bumping applications at a range of temperatures.

Semiconductor Packaging Materials

  • Solder Bump Plating

    Solder Bump Plating

    DuPont’s award-winning Solderon™ BP electroplating chemistries are a reliable alternative to tin-lead alloys for all wafer bumping applications.

    Indium plating chemistry designed for low-temperature solder plating processes used in advanced wafer-level packaging for emerging applications that are sensitive to temperature.

    HVM-proven tin-silver plating chemistry for lead-free, fine-pitch solder bump applications with industry-leading process versatility.
  • Copper Pillar Plating

    Copper Pillar Plating

    Our production-proven Cu pillar formulations work in perfect harmony with our under-bump metallization (UBM) and tin-silver capping chemistries, to provide a seamless solution for all your Cu pillar needs.

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  • Copper Redistribution Layer

    Copper Redistribution Layer

    DuPont Electronics & Imaging copper chemistries for redistribution layers (RDLs) are ideally suited to today’s high-density requirements for wafer level packaging applications.

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  • Under Bump Metallization

    Under Bump Metallization

    We offer a production-proven electroplating nickel chemistry tailored to meet a variety of UBM process needs

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  • Bump Plating Photoresists

    Bump Plating Photoresists

    DuPont offers positive- and negative-tone photoresists designed to meet the tight pitches and varied topographies of today’s semiconductor advanced packaging applications.

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    Wafer-level packaging dry-film photoresist solutions for 3DIC, fan out, bumping, copper pillar and redistribution applications.

    DuPont offers liquid bump plating photoresists, along with associated ancillaries, that are ideally suited for wafer-level packaging applications using single-spin coating.
  • Through Silicon Via Copper

    Through Silicon Via Copper

    Years of experience and success in electroplating damascene copper have helped DuPont bring leading-edge copper TSV chemistries to the advanced packaging market.

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  • Packaging Dielectrics

    Packaging Dielectrics

    Look to DuPont for packaging dielectric formulations that have the mechanical properties, high resolution, low-temp curing, easy processes, and superior reliability needed to protect your advanced WLP.

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