DuPont Electronics and Imaging’s award-winning Solderon™ BP electroplating chemistries are reliable alternatives to tin-lead alloys for all wafer bumping applications, from standard C4 solder bumps to capping fine-pitch Cu µpillars.
Our lead-free, single-step plating materials are specifically designed for the most challenging advanced wafer-level packaging applications. A variety of formulations including tin-silver alloys, pure tin, and indium materials meet a range of process temperatures and melting points, suiting both high- and low-temperature processing needs. Designed to overcome our customers’ most difficult challenges, such as voiding and throughput, Solderon™ products feature:
DuPont Electronics & Imaging leads the way with low-alpha materials by offering tin with low-alpha-particle-emitting versions of our products, which are ideal for packaging applications sensitive to the effects of these emissions.
Solder bumps form the electronic interconnect between a chip and its substrate. In wafer level packaging processes, bumps range in size and shape from standard C4 bumps, to solder caps on Cu pillars and µpillars.
Solder bumps form the electronic interconnect between a chip and its substrate. In wafer level packaging processes, bumps range in size and shape from standard C4 bumps, to solder caps on Cu pillars and µpillars.
DuPont delivers a full portfolio of packaging and assembly materials for the semiconductor industry. Click here to view a short video of our comprehensive offerings.
DuPont’s award-winning Solderon™ BP electroplating chemistries are a reliable alternative to tin-lead alloys for all wafer bumping applications.
Our production-proven Cu pillar formulations work in perfect harmony with our under-bump metallization (UBM) and tin-silver capping chemistries, to provide a seamless solution for all your Cu pillar needs.
View DetailsDuPont Electronics & Imaging copper chemistries for redistribution layers (RDLs) are ideally suited to today’s high-density requirements for wafer level packaging applications.
View DetailsWe offer a production-proven electroplating nickel chemistry tailored to meet a variety of UBM process needs
View DetailsDuPont offers positive- and negative-tone photoresists designed to meet the tight pitches and varied topographies of today’s semiconductor advanced packaging applications.
View DetailsYears of experience and success in electroplating damascene copper have helped DuPont bring leading-edge copper TSV chemistries to the advanced packaging market.
View DetailsLook to DuPont for packaging dielectric formulations that have the mechanical properties, high resolution, low-temp curing, easy processes, and superior reliability needed to protect your advanced WLP.
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