Years of experience and success in electroplating damascene copper have helped DuPont Electronics & Imaging bring leading-edge copper through silicon via (TSV) chemistries to the advanced packaging market. Our production-proven, three-component copper solutions enable even the most challenging TSV aspect ratios due to:
As TSVs become a mainstream interconnect technology used in memory stacking, CMOS image sensors, MEMS devices, and 2.5D interposer architectures, DuPont remains at the forefront, optimizing offerings to meet TSVs evolving needs.
Through silicon vias (TSVs) are vertical electrical interconnects formed using wafer etch processes and filled with either Cu or tungsten. First introduced in compound semiconductor applications, TSVs are also used in MEMS devices and CMOS image sensors, to create 3D memory stacks, and 2.5D interposer architectures, driven by high-performance computing needs.
Our Cu chemistries for TSV production are designed to meet requirements for leading edge TSVs with a 10:1 aspect ratio. This requires high purity, faster plating speeds without voids, gap-free bottom-up fill with minimal Cu overburden to reduce the need for chemical mechanical planarization processes.
Years of experience and success in electroplating damascene copper have helped DuPont bring leading-edge copper TSV chemistries to the advanced packaging market.
Our production-proven Cu pillar formulations work in perfect harmony with our under-bump metallization (UBM) and tin-silver capping chemistries, to provide a seamless solution for all your Cu pillar needs.View Details
DuPont’s award-winning Solderon™ BP electroplating chemistries are a reliable alternative to tin-lead alloys for all wafer bumping applications.View Details
Indium plating chemistry designed for low-temperature solder plating processes used in advanced wafer-level packaging for emerging applications that are sensitive to temperature.
HVM-proven tin-silver plating chemistry for lead-free, fine-pitch solder bump applications with industry-leading process versatility.
We offer a production-proven electroplating nickel chemistry tailored to meet a variety of UBM process needsView Details
DuPont offers positive- and negative-tone photoresists designed to meet the tight pitches and varied topographies of today’s semiconductor advanced packaging applications.View Details
Wafer-level packaging dry-film photoresist solutions for 3DIC, fan out, bumping, copper pillar and redistribution applications.
DuPont offers liquid bump plating photoresists, along with associated ancillaries, that are ideally suited for wafer-level packaging applications using single-spin coating.
DuPont Electronics & Imaging copper chemistries for redistribution layers (RDLs) are ideally suited to today’s high-density requirements for wafer level packaging applications.View Details
Look to DuPont for packaging dielectric formulations that have the mechanical properties, high resolution, low-temp curing, easy processes, and superior reliability needed to protect your advanced WLP.View Details