DuPont adhesiveless all polyimide copper clad flexible laminates (CCL), using high performance Kapton® composite dielectrics, are available in a wide variety of copper types, thicknesses and construction options.
These laminates provide lightweight, both thin and thick, and highly reliable substrates featuring superior circuit trace adhesion strength, lower Dk and Df properties, extreme environmental stability, and greater design latitude for high frequency and impedance controlled applications.
DuPont adhesiveless all polyimide copper clad flexible laminates (CCL) are available in a wide variety of copper types, thicknesses and construction options.VIEW DETAILS
Superior bond strength and flexibility for high volume applicationsVIEW DETAILS
Our family of epoxy-based adhesive solutions offers superior peel strength, chemical, and heat resistance.VIEW DETAILS
DuPont’s family of fluoropolymer adhesive solutions delivers superior performance in high-speed and high frequency applications.VIEW DETAILS
Interra® thin copper clad laminates for embedded capacitance.VIEW DETAILS