DuPont designs microlithography materials to improve existing microlithography processes as well as support advanced patterning processes. Our long history in lithography technology includes many industry-first enabling technology innovations. We lead the market in terms of our breadth of offerings, including ArF photoresists, KrF photoresists, i/g line photoresists, and organic bottom anti-reflective coating (BARC) materials.
By collaborating with you to understand your technical challenges, we develop materials solutions to meet them. The more advanced the process, the more critical it is to work in partnership to design specific materials.
DuPont is here to support you with your biggest (and smallest) lithography challenges!
Microlithography, or photolithography, is an imaging technology that is critical to etch steps in semiconductor manufacturing. It is used to transfer circuitry patterns from a photomask to a silicon wafer, after which etch processes complete the pattern.
Driven by ubiquitous high-performance, low-power computing needs, the semiconductor manufacturing industry continues to shrink feature sizes to make faster and smaller transistors with higher storage capacity. This requires high-quality and high-performing lithography materials.
DuPont’s robust, production-proven photoresist product line offers materials options that meet the requirements across generations of lithography processes.View Details
Positive tone ArF (193 nm) dry photoresists optimized for trench and line/space applications
Positive tone 193 nm immersion resists with an excellent process window, CD uniformity and low defectivity
Positive tone 193 nm implant resists with good profile through pitch and excellent substrate compatibility
Used in conjunction with photoresists, DuPont’s advanced overcoat materials are designed to prevent defects and improve the lithography process window, enabling finer feature patterns.View Details
Anti-reflective coatings and sublayers boost the effectiveness of lithography by widening and improving the process and reflectivity windows.View Details
An organic, thermally cross-linking BARC for 248 nm photoresists
An organic bottom anti-reflectant coating (oBARC) for immersion lithography
An organic gap filling material for extremely narrow trenches
An organic, thermally cross-linking bottom anti-reflectant for 248 nm (KrF) photoresist
A family of cross-linkable BARCs that can etch 30% faster than photoresists
DuPont’s roots run deep in its production-proven line of ancillary lithography products. From developers, removers, and other enhancement chemistries, we support a total lithography solution.View Details
DUV and 193nm photoresist performance begins with the polymer, and DuPont electronic grade polymers continue to improve upon existing techniques for polymer manufacture, isolation, and evaluation.View Details
We offer services such as defect testing or patterning wafersView Details