Lithographic Imaging Services & Metrology for Defect Testing
Our Fabs Can Help with Your Imaging and Metrology Projects
Let’s talk about how the technical experts in our fabs can help with your lithography projects. In addition to supplying materials for lithography, with our advanced lithographic imaging and metrology equipment, we can help with other aspects of your workflow. Services available include measurement, defect testing, process design, or supplying patterned wafers.
Our fabs have a range of tools from g-line and i-line lithography to ArF immersion lithography, and to better support our customers and the semiconductor industry, we are now able to make these available for custom or batch tests. Tests can be done on a one-time basis or long-term as a recurring event. We also have a full suite of metrology tools that can be used in conjunction with lithographic imaging performed at our facility or on wafers imaged off-site. Our experts are also available to assist with the development of new lithographic processes and we can supply our lithography materials (such as photoresists, anti-reflective coatings and ancillaries) as part of a process design or project.
Read on to see the types of lithographic imaging and metrology tools available, as well as examples of services we can offer. Please don’t hesitate to contact us with any potential project, even if it is not listed here.
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Service Examples
The following examples show the types of work we can do using our equipment:
- CD Measurement: Measurement of CDs across features that you specify for your patterned ArF resist wafers, including data analysis and a summary report.
- ArF Imaged Wafers: Imaging of wafers patterned using our photoresist, antireflective coatings, and top coat products using immersion ArF conditions.
- Defect Analysis: Measurement, review, and defect analysis (including EDX) for your patterned wafers.
- Process Development: The development of a new patterning process using our resists and ancillaries, based on your design requirements. Process testing using your production wafers.
- Material Screening: Coating and ArF patterning evaluation of sample materials, including a summary of test results and data.
These examples represent a small sampling of the types of services we can offer. Lithographic imaging and metrology are often custom designs as determined by the needs of the project, so please don’t hesitate to contact us to discuss your specific project needs.
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Lithographic Capabilities
Technology
Wafer Size (mm)
Capability
ArF (193nm Immersion)
300
Coat and Pattern
ArF (193nm Dry)
200
Coat and Pattern
KrF (248nm)
200
Coat and Pattern
i-line (365nm)
200
Coat and Pattern
i-line (365nm)
100
Coat and Flood Exposure
Broad Band
200
Coat and Pattern
Broad Band
100
Coat and Flood Exposure
g-line (436nm)
100
Coat and Pattern
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Metrology Equipment
Metrology
Wafer Size (mm)
Description
Thin Film Measurement
100/200/300
Optical Parameter
Critical-Dimension Scanning
Electron Microscopes (CD-SEM)200/300
CD Measurement
Defect
200/300
Film Defect Inspection Tool,
Patterned Defect Inspection Tool,
Defect Review Tool,
Scanning Electron MicroscopesScanning Electron Microscopes
All
Scanning Electron Microscope,
Cross Sectional ImageScanning Electron Microscopes
100/150/200
Top Down, X-ray,
Back Scatter,
Defect Review
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Additional Toolsets
Capability
Wafer Size (mm)
Tool Set
Dissolution Rate
100/150
Single Point DRM Laser, GCA, DNS
Optical Density
100
UV-Vis, GCA
Dill
10
Flood Exposure Tool, UV-Vis, GCA
Lithography Materials and Services
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Metrology & Imaging Services
Metrology & Imaging Services
We offer services such as defect testing or patterning wafers
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Advanced Overcoats
Advanced Overcoats
Used in conjunction with photoresists, DuPont’s advanced overcoat materials are designed to prevent defects and improve the lithography process window, enabling finer feature patterns.
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Anti-Reflectants & Functional Sublayers
Anti-Reflectants & Functional Sublayers
Anti-reflective coatings and sublayers boost the effectiveness of lithography by widening and improving the process and reflectivity windows.
An organic gap filling material for extremely narrow trenchesA family of cross-linkable BARCs that can etch 30% faster than photoresistsAR™ 10L is an organic, thermally cross-linking bottom anti-reflectant coating (BARC) for 248 nm (KrF) photoresists. It is designed to provide a universal anti-reflective surface for high- and low-temperature resist platforms and offers excellent compatibility with most ESCAP HYBRID and Acetal resists.AR™ 137 is an organic bottom anti-reflectant coating (oBARC) for immersion lithography. It is designed to provide excellent optical parameters to minimize reflection through angles for hyper numerical aperture (NA) immersion exposure.AR™ 254 is an organic, thermally cross-linking bottom anti-reflectant for 248 nm (KrF) photoresist. It has excellent gap filling and planarizing properties that are key requirements for advanced semiconductor devices having FinFET structures. AR™ 254 has a high etch rate to reduce substrate damage and optimal optical parameters to minimize reflectance. -
Ancillary Lithography Materials
Ancillary Lithography Materials
DuPont’s roots run deep in its production-proven line of ancillary lithography products. From developers, removers, and other enhancement chemistries, we support a total lithography solution.
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Electronic Grade Polymers | DuPont Electronic Solutions
Electronic Grade Polymers | DuPont Electronic Solutions
DUV and 193nm photoresist performance begins with the polymer, and DuPont electronic grade polymers continue to improve upon existing techniques for polymer manufacture, isolation, and evaluation.
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Photoresists
Photoresists
DuPont’s robust, production-proven photoresist product line offers materials options that meet the requirements across generations of lithography processes.
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