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Advanced Overcoats

 
 
 

Advanced Overcoats

Supporting Today’s Critical Dimensions in Lithography

DuPont’s state-of-the-art advanced overcoat products decrease the occurrence of defects before or after wafer patterning. Our unique formulations provide you with new solutions for today’s patterning challenges, enabling you to reach critical dimensions that can’t be achieved through conventional lithography processes alone. Scaling to advanced nodes without extreme ultra violet (EUV) lithography is now possible.

DuPont’s advanced overcoat product lines for lithography include:

  • Topcoats: Designed for positive tone photoresists, our positive tone development topcoats increase hydrophobicity of the photoresist surface, decreasing defects.

  • NTO™ Overcoats: Intended for yield enhancement, our negative tone, spin-on formulations create a uniform surface across multiple resists with different surface properties. These materials allow for multiple scanner adjustments to be made as if it were a single resist. NTO Overcoats feature high hydrophobicity and achieve a high contact angle.

  • CTO™ Overcoats: These spin-on alternatives to plasma-etch processes are a low-cost way to trim critical dimensions by reducing bridging defects that form at the top of the resist. CTO Overcoats reduce scum in darkfield features and can be used to clean difficult-to-remove resist from isolated trenches.

  • Product families:
    • NTO™ 5000 Overcoat
    • CTO™ 1150 Overcoat
    • CTO™ 125 Overcoat
 
 
 

  • Advanced overcoats are materials intended for use in conjunction with photoresists, either before or after the photolithography step. They are designed to prevent defects and improve the lithography process window.  

    • Coating an NTO™ Overcoat on top of photoresist before patterning creates a hydrophobic surface that prevents water droplets from forming during immersion lithography processes
    • As an alternative to EUV lithography, CTO™ Overcoat can be applied after ArF lithography to reduce the amount of remaining photoresist and shrink the patterning lines
 
 
 

Lithography Materials and Services

 
 
 

  • Advanced Overcoats

    Used in conjunction with photoresists, DuPont’s advanced overcoat materials are designed to prevent defects and improve the lithography process window, enabling finer feature patterns.

  • Photoresists

    DuPont’s robust, production-proven photoresist product line offers materials options that meet the requirements across generations of lithography processes.

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  • Anti-Reflectants & Functional Sublayers

    Anti-reflective coatings and sublayers boost the effectiveness of lithography by widening and improving the process and reflectivity windows.

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    An organic gap filling material for extremely narrow trenches

    A family of cross-linkable BARCs that can etch 30% faster than photoresists

    AR™ 10L is an organic, thermally cross-linking bottom anti-reflectant coating (BARC) for 248 nm (KrF) photoresists. It is designed to provide a universal anti-reflective surface for high- and low-temperature resist platforms and offers excellent compatibility with most ESCAP HYBRID and Acetal resists.

    AR™ 137 is an organic bottom anti-reflectant coating (oBARC) for immersion lithography. It is designed to provide excellent optical parameters to minimize reflection through angles for hyper numerical aperture (NA) immersion exposure.

    AR™ 254 is an organic, thermally cross-linking bottom anti-reflectant for 248 nm (KrF) photoresist. It has excellent gap filling and planarizing properties that are key requirements for advanced semiconductor devices having FinFET structures. AR™ 254 has a high etch rate to reduce substrate damage and optimal optical parameters to minimize reflectance.

  • Ancillary Lithography Materials

    DuPont’s roots run deep in its production-proven line of ancillary lithography products. From developers, removers, and other enhancement chemistries, we support a total lithography solution.

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  • Electronic Grade Polymers | DuPont Electronic Solutions

    DUV and 193nm photoresist performance begins with the polymer, and DuPont electronic grade polymers continue to improve upon existing techniques for polymer manufacture, isolation, and evaluation.

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  • Metrology & Imaging Services

    We offer services such as defect testing or patterning wafers

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