DuPont’s complete line of anti-reflectant coatings and functional sublayer products include bottom anti-reflective coatings (BARCs), spin-on-carbons (SOCs) and extreme ultraviolet (EUV) underlayers. They are formulated to address advanced lithography challenges posed by the critical dimensions of today’s advanced technology nodes and 3D structures, improving throughput and enabling higher resolution to 20nm line pitches.
Anti-reflective coatings and sublayers – BARCs and SiARCs, and SOCs – are used to boost the effectiveness of lithography by widening and improving the process and reflectivity windows:
Anti-reflective coatings and sublayers boost the effectiveness of lithography by widening and improving the process and reflectivity windows.
Used in conjunction with photoresists, DuPont’s advanced overcoat materials are designed to prevent defects and improve the lithography process window, enabling finer feature patterns.
DuPont’s robust, production-proven photoresist product line offers materials options that meet the requirements across generations of lithography processes.
DuPont’s roots run deep in its production-proven line of ancillary lithography products. From developers, removers, and other enhancement chemistries, we support a total lithography solution.
DUV and 193nm photoresist performance begins with the polymer, and DuPont electronic grade polymers continue to improve upon existing techniques for polymer manufacture, isolation, and evaluation.
We offer services such as defect testing or patterning wafers