Ancillary Lithography Materials


Enhancement Chemistries to Support a Total Lithography Solution

DuPont’s roots run deep in its production-proven line of ancillary lithography products. From organic and inorganic developers to a full suite of removers, strippers, and edge-bead solvents and cleaning products, our formulations stand the test of time and provide customers with a complete solution across the spectrum of lithography processes.

DuPont’s global manufacturing and support footprint make these low-cost solutions easily accessible.  

  • Our developers are designed to be application-specific and to suit customer preferences.Choose from our metal ion free (MIF) organic and metal ion bearing (MIB) inorganic developers that come in a variety of formulations including:

    • MIB inorganic developers
    • MIF organic developers
      • Surfactant-aided
      • Low-foaming
      • Surfactant-free versions
    • Pre-blended formulations provide ease-of-use and added safety benefits
    • Concentrated forms available for use with automated dilution systems. 
  • Filtered and processed to ensure the highest purity solvents, our removers and strippers create clean lines prior to photoresist deposition. This results in low defects, even at advanced technology nodes.

    • Bulk removers are available for immersion or batch spray
    • Post-etch residue removers are available for immersion, batch spray, or single wafer processing

    DuPont offers a complete line of supporting chemistries formulated as companions to our photoresists, to cover multiple facets for different processing conditions. These include:

    • Fluorine-based post-etch residue remover
    • FST™-M protective wafer coat for improved post-strip handling
    • Proprietary lift-off layer process for trench metallization without CMP

Lithography Materials and Services

  • Ancillary Lithography Materials

    DuPont’s roots run deep in its production-proven line of ancillary lithography products. From developers, removers, and other enhancement chemistries, we support a total lithography solution.

  • Advanced Overcoats

    Used in conjunction with photoresists, DuPont’s advanced overcoat materials are designed to prevent defects and improve the lithography process window, enabling finer feature patterns.

  • Anti-Reflectants & Functional Sublayers

    Anti-reflective coatings and sublayers boost the effectiveness of lithography by widening and improving the process and reflectivity windows.

    An organic gap filling material for extremely narrow trenches

    A family of cross-linkable BARCs that can etch 30% faster than photoresists

    AR™ 10L is an organic, thermally cross-linking bottom anti-reflectant coating (BARC) for 248 nm (KrF) photoresists. It is designed to provide a universal anti-reflective surface for high- and low-temperature resist platforms and offers excellent compatibility with most ESCAP HYBRID and Acetal resists.

    AR™ 137 is an organic bottom anti-reflectant coating (oBARC) for immersion lithography. It is designed to provide excellent optical parameters to minimize reflection through angles for hyper numerical aperture (NA) immersion exposure.

    AR™ 254 is an organic, thermally cross-linking bottom anti-reflectant for 248 nm (KrF) photoresist. It has excellent gap filling and planarizing properties that are key requirements for advanced semiconductor devices having FinFET structures. AR™ 254 has a high etch rate to reduce substrate damage and optimal optical parameters to minimize reflectance.
  • Photoresists

    DuPont’s robust, production-proven photoresist product line offers materials options that meet the requirements across generations of lithography processes.

  • Electronic Grade Polymers | DuPont Electronic Solutions

    DUV and 193nm photoresist performance begins with the polymer, and DuPont electronic grade polymers continue to improve upon existing techniques for polymer manufacture, isolation, and evaluation.

  • Metrology & Imaging Services

    We offer services such as defect testing or patterning wafers


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