DuPont brings a deep understanding of materials science to the printed circuit board (PCB) market. We provide materials that support all aspects of PCB manufacturing for many types of PCBs: single- or double-sided boards and flexible, rigid-flex, or rigid configurations.
Tap into our long history as a market leader in flexible PCB laminates, dry film photoresists, and high-reliability metallization to determine the best combination of materials to enhance the performance of your PCBs. We allow you to push the design envelope and create products that perform faster and more reliably.
Our broad portfolio of PCB materials includes films, laminates, photoresists, and metallization. We continue to bring new products to market to create reliable PCBs with increased circuit density that function well under demanding environmental conditions.
Choose DuPont as your materials solutions partner to:
PCB manufacturing involves many steps—depositing metal and photoresist layers, imaging, etching, and stripping—all of which require materials tailored for a specific function. Whether they remain on the board or are removed during the manufacturing process, all PCB materials affect the performance and reliability of the final product.
The drive toward miniaturization in the consumer electronics and telecom sectors requires PCBs with higher circuit density, which puts greater demands on the metal and dielectric layers as line widths and spacings decrease. Choosing the right materials improves yield and controls manufacturing costs.
PCBs in automotive applications must operate reliably under conditions of high temperature and high voltage, where signal integrity is critical for safety. As the number of boards and components in vehicles increases, more function must be packed into a smaller space, elevating the importance of materials that enable compact, highly reliable designs.
Reliable metallization for high-performing flexible and rigid PCBs.View Details
Copper plating to meet the demands of flexible PCBs.
Our highly conformal copper plating will enable any HDI design to perform well.
Copper plating solutions for substrates in all types of advanced packages.
Metallization to enable high-performance rigid PCBs.
Laminate materials to enable the highest performing flexible and rigid-flex PCBsView Details
Superior bond strength and flexibility for high volume applications
DuPont adhesiveless all polyimide copper clad flexible laminates (CCL) are available in a wide variety of copper types, thicknesses and construction options.
Our family of epoxy-based adhesive solutions offers superior peel strength, chemical, and heat resistance.
DuPont’s family of fluoropolymer adhesive solutions delivers superior performance in high-speed and high frequency applications.
Interra® thin copper clad laminates for embedded capacitance.
From circuits in cameras in space to next-gen photovoltaic cells, polyimide films are helping make extraordinary new design possibilities actually happen.View Details
Maintains its unique combination of mechanical properties under the harshest of conditions.
Our portfolio of products is specifically engineered to enable PCB fabricators to easily achieve higher yields and greater productivity, even with today's most challenging designs.View Details
Used in tenting, plating, akaline etching or innerlayer applications.
For use in exposing liquid and dry film photoresists (including solder masks) employed in the manufacture of PWBs.
The CB Series of screen printed ink materials are used for additive, low temperature processing on both rigid and flexible printed circuit boards (PCBs).