High-Density Interconnect (HDI)
Meeting the specialized needs of HDI boards
DuPont’s long history of expertise in copper electroplating allows us to meet the needs of the next generation of high-density PCBs. We provide highly conformal copper plating that will enable any of your HDI designs, no matter how complex, to perform well.
Choose DuPont as your materials solutions partner to provide:
- Cost-effective conformal copper plating for HDI boards
- Metallization that will enhance board reliability
- Multiple plating options tailored to your specific application
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Meeting Miniaturization Demands
Miniaturization of electronic devices is driving the need for highly reliable metallization that can connect ever smaller metal lines and vias on advanced HDI boards. Designs include laser-drilled blind microvias as well as through holes with high aspect ratios. Both types of vias need to be filled completely without depositing excess copper
Metallization Materials for PCBs
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High Density Interconnect
High Density Interconnect
Our highly conformal copper plating will enable any HDI design to perform well.
The 3350-1 electroless copper bath is formulated to provide improved physical properties and produce exceptionally fine-grain, low-stress deposits, which yield enhanced hole-wall coverage and excellent adhesion even on the most demanding high-performance substrates.Circuposit™ 4500 Electroless Copper is a self-accelerating electroless copper bath designed for use in the horizontal mode, and can be used in either high or low build applications.A black oxide product that promotes innerlayer adhesion of copper in multi-layer circuit board fabrication.
A solvent swell product designed to enhance the resin texturing and smear removal of high Tg materials in the subsequent Circuposit™ Promoter stage.
New generation SAP electroless copper for IC substrate.
Specifically formulated for use with copper anodes and direct current (DC) rectification, offers excellent through-hole throwing power combined with excellent conformal microvia plating.
The advanced solution for high speed direct current copper pillar technology.
Designed to lower board manufacturer's ENIG process costs, while maintaining optimum reliability and performanceA high phosphorous Electroless Nickel specifically formulated for use in combination with the Aurolectroless™ SMT 520 Immersion Gold processProviding complete fill at lower copper thickness, reduced dimples and skip-rate, and improved surface appearance -
Multi-Layered Boards
Multi-Layered Boards
Metallization to enable high-performance rigid PCBs.
The 3350-1 electroless copper bath is formulated to provide improved physical properties and produce exceptionally fine-grain, low-stress deposits, which yield enhanced hole-wall coverage and excellent adhesion even on the most demanding high-performance substrates.Circuposit™ 4500 Electroless Copper is a self-accelerating electroless copper bath designed for use in the horizontal mode, and can be used in either high or low build applications.A black oxide product that promotes innerlayer adhesion of copper in multi-layer circuit board fabrication.
A solvent swell product designed to enhance the resin texturing and smear removal of high Tg materials in the subsequent Circuposit™ Promoter stage.
Eliminating the need for a separate accelerator step, saving space, increasing process speed, and improving reliability and quality.
New generation SAP electroless copper for IC substrate.
The advanced solution for high speed direct current copper pillar technology.
Delivering high plating efficiency to improve productivity and reduce cost.
Designed to lower board manufacturer's ENIG process costs, while maintaining optimum reliability and performanceA high phosphorous Electroless Nickel specifically formulated for use in combination with the Aurolectroless™ SMT 520 Immersion Gold processA UV-curable acrylic hybird ink that redefines the etching process for PCB innerlayer fabricationProviding complete fill at lower copper thickness, reduced dimples and skip-rate, and improved surface appearanceFormulated for use in combination with Duraposit™ electroless nickel baths and Aurolectroless™ immersion gold baths to provide uniform ENEPIG deposits for final finishing of PCBsA wide range of supporting products for developing, etching and stripping processes that compliment our photo imageable products -
IC Substrates
IC Substrates
Copper plating solutions for substrates in all types of advanced packages.
Circuposit™ 4500 Electroless Copper is a self-accelerating electroless copper bath designed for use in the horizontal mode, and can be used in either high or low build applications.Improving adhesion of the subsequent metal layer for next-generation dielectric materialsThe advanced solution for high speed direct current copper pillar technology.
Formulated for use in combination with Duraposit™ electroless nickel baths and Aurolectroless™ immersion gold baths to provide uniform ENEPIG deposits for final finishing of PCBs -
Flexible Circuits
Flexible Circuits
Copper plating to meet the demands of flexible PCBs.
A patented 3-step desmear to effectively clean, condition and activate hole-wall surfaces.Circuposit™ 4500 Electroless Copper is a self-accelerating electroless copper bath designed for use in the horizontal mode, and can be used in either high or low build applications.Processes especially designed for operation in vertical and horizontal equipment respectivelyDesigned to lower board manufacturer's ENIG process costs, while maintaining optimum reliability and performanceTape Automated Bonding
Immersion tin for TAB and COF manufacturing.
Supporting products for pre and post treatment to enhance the performance of the TAB/COF products.Leading immersion tin products providing exceptional performance with low running cost.
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