DuPont’s long history of expertise in copper electroplating allows us to meet the needs of the next generation of high-density PCBs. We provide highly conformal copper plating that will enable any of your HDI designs, no matter how complex, to perform well.
Choose DuPont as your materials solutions partner to provide:
Miniaturization of electronic devices is driving the need for highly reliable metallization that can connect ever smaller metal lines and vias on advanced HDI boards. Designs include laser-drilled blind microvias as well as through holes with high aspect ratios. Both types of vias need to be filled completely without depositing excess copper
Our highly conformal copper plating will enable any HDI design to perform well.
Metallization to enable high-performance rigid PCBs.
Copper plating solutions for substrates in all types of advanced packages.
Copper plating to meet the demands of flexible PCBs.
Immersion tin for TAB and COF manufacturing.