High-Density Interconnect (HDI)

Meeting the specialized needs of HDI boards

DuPont’s long history of expertise in copper electroplating allows us to meet the needs of the next generation of high-density PCBs. We provide highly conformal copper plating that will enable any of your HDI designs, no matter how complex, to perform well.

Choose DuPont as your materials solutions partner to provide:

  • Cost-effective conformal copper plating for HDI boards
  • Metallization that will enhance board reliability
  • Multiple plating options tailored to your specific application
  • Miniaturization of electronic devices is driving the need for highly reliable metallization that can connect ever smaller metal lines and vias on advanced HDI boards. Designs include laser-drilled blind microvias as well as through holes with high aspect ratios. Both types of vias need to be filled completely without depositing excess copper


Metallization Materials for PCBs


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