Advanced Package

Various thickness offering (50µ m ~ 240 µ m) with better via resolution capability to meet future design challenges

Riston® EtchMaster dry film photoresist is specifically designed as an acid etching film that delivers high yields in fine line applications. These photoresists provide excellent conformation using dry lamination and possess wide exposure, developing and stripping latitude.

DuPont has developed the Riston® FX Series of photoresists to help fabricators address challenges of producing fine lines at high yields.

Riston® GoldMaster is a fully aqueous resist that simplifies circuit board fabrication with special gold plating or nickel plating finishes

Ultra fast photospeed, high performance, and compatibility with conventional printed wiring board (PWB) processes are critical to help PWB fabricators optimize their LDI equipment investments.

DuPont™ Riston® MultiMaster Series simplifies the manufacturing operation by eliminating the need for different films in your production line.

Riston® PlateMaster was formulated to achieve consistently high yields by providing outstanding plated line uniformity, fine line resolution, and wide surface tolerance on direct metallization and panel plate.

DuPont™ Riston® TentMaster provides excellent tenting capability, outstanding conformation, excellent resolution and remarkable tolerance to off-contact exposure.

YieldMaster® Technology delivers optimum yields through the use of a specially developed thin resist, lamination system

Better adhesion, resolution and chemical resistance performance to overcome design challenges from CSP and BGA application.

Excellent tenting, chemical resistance and wind operation window enable higher yield.

Fine line direct imaging photoresist solution for HDI mSAP  application.

Superior resolution capability for HDI pitch 70~100µ m design (DI9000); Well balanced tenting and resolution capability to meet both Inner layer and outer layer design requirement (DI8600).