DuPont’s longstanding expertise in electroless copper plating is an excellent match for the demands of flexible and rigid-flex circuits built with polyimide. As more applications migrate to flexible boards, DuPont is committed to providing solutions that will enable high performance in any design configuration. Our highly conductive copper metallization is compatible with roll-to-roll processing and low-stress for long-term durability.
Choose DuPont as your materials solutions partner to provide:
Flexible circuits pose unique challenges for metallization. The tight bending radii present in many design configurations require flexible metal layers with high electrical conductivity. Copper can be an ideal material when deposited in a manner that is compatible with the flexible circuit manufacturing process, which is often done on roll-to-roll equipment.
Copper plating to meet the demands of flexible PCBs.
Immersion tin for TAB and COF manufacturing.
Metallization to enable high-performance rigid PCBs.
A black oxide product that promotes innerlayer adhesion of copper in multi-layer circuit board fabrication.
A solvent swell product designed to enhance the resin texturing and smear removal of high Tg materials in the subsequent Circuposit™ Promoter stage.
Eliminating the need for a separate accelerator step, saving space, increasing process speed, and improving reliability and quality.
New generation SAP electroless copper for IC substrate.
The advanced solution for high speed direct current copper pillar technology.
Delivering high plating efficiency to improve productivity and reduce cost.
Our highly conformal copper plating will enable any HDI design to perform well.
A black oxide product that promotes innerlayer adhesion of copper in multi-layer circuit board fabrication.
A solvent swell product designed to enhance the resin texturing and smear removal of high Tg materials in the subsequent Circuposit™ Promoter stage.
New generation SAP electroless copper for IC substrate.
Specifically formulated for use with copper anodes and direct current (DC) rectification, offers excellent through-hole throwing power combined with excellent conformal microvia plating.
The advanced solution for high speed direct current copper pillar technology.
Copper plating solutions for substrates in all types of advanced packages.
The advanced solution for high speed direct current copper pillar technology.
We love to talk about how our electronics solutions can build business, commercialize products,
and solve the challenges of our time.