DuPont’s metallization and imaging products act as key enabling technologies for the high-end multi-layer PCBs that reside in computers, smartphones, and automobiles. As you increase layer count, you can’t afford to compromise reliability. We offer a variety of products that will allow your products to perform their best. Materials include:
Choose DuPont as your materials solutions partner to:
The number of layers in PCBs has increased to the point where etching and depositing metal can be a performance-limiting step. Holes are narrower in diameter and deeper than ever before, making via preparation, coating, and filling critical. High-speed, high-frequency applications are especially sensitive. Metallization needs to be tailored to the dielectric material and the board geometry to ensure reliable performance of HAR boards with small feature sizes.
Metallization to enable high-performance rigid PCBs.
Copper plating solutions for substrates in all types of advanced packages.
Our highly conformal copper plating will enable any HDI design to perform well.
Copper plating to meet the demands of flexible PCBs.
Immersion tin for TAB and COF manufacturing.