DuPont has long been a market leader in high-performance, high-reliability metallization for demanding PCB applications. As shrinking design guidelines and more challenging operating environments make metallization performance critical to the success of multilayer boards, DuPont is prepared to provide materials that allow you to meet your design goals.
We offer a wide variety of options for interlayer metallization, via fill, and final finishes tailored to substrate type and end application. Our materials support your metallization process every step of the way in applications including:
Choose DuPont as your materials solutions partner to:
Both rigid and flexible PCBs contain multiple layers of interconnected metal lines. Trends toward device miniaturization and increased functionality are driving down line widths and spacings as well as via diameters. Metallization must be reliable and uniform regardless of surface topography.
Manufacturers of consumer electronics, automobiles, airplanes, 5G networks, and industrial equipment rely on high-density PCBs to keep their customers connected and safe. The metallization inside these PCBs has to be reliable no matter how fine the metal lines or how densely packed the design. Because of cost pressure, yields need to remain high. Choosing metallization products tailored to the type of substrate and the design density optimizes both yield and reliability.
Copper plating solutions for substrates in all types of advanced packages.
The advanced solution for high speed direct current copper pillar technology.
Metallization to enable high-performance rigid PCBs.
A black oxide product that promotes innerlayer adhesion of copper in multi-layer circuit board fabrication.
A solvent swell product designed to enhance the resin texturing and smear removal of high Tg materials in the subsequent Circuposit™ Promoter stage.
Eliminating the need for a separate accelerator step, saving space, increasing process speed, and improving reliability and quality.
New generation SAP electroless copper for IC substrate.
The advanced solution for high speed direct current copper pillar technology.
Delivering high plating efficiency to improve productivity and reduce cost.
Our highly conformal copper plating will enable any HDI design to perform well.
A black oxide product that promotes innerlayer adhesion of copper in multi-layer circuit board fabrication.
A solvent swell product designed to enhance the resin texturing and smear removal of high Tg materials in the subsequent Circuposit™ Promoter stage.
New generation SAP electroless copper for IC substrate.
Specifically formulated for use with copper anodes and direct current (DC) rectification, offers excellent through-hole throwing power combined with excellent conformal microvia plating.
The advanced solution for high speed direct current copper pillar technology.
Copper plating to meet the demands of flexible PCBs.
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