DuPont has been a leading innovator and global supplier of imaging materials for the printed circuit board (PCB) industry for more than 40 years.
DuPont imaging materials are key in the fabrication of printed circuit boards. Fabricators challenged to produce denser and more complex boards choose DuPont for improved product and process solutions. Our portfolio of products is specifically engineered to enable PCB fabricators to easily achieve higher yields and greater productivity, even with today's most challenging designs.
DuPont™ Riston® products meet the industry demands for finer features, higher quality and lower cost in all types of plating and etching applications. DuPont™ Riston® dry film, the first dry film photopolymer photoresist, makes the fabrication of printed circuit boards more productive and more reliable.
Used in tenting, plating, akaline etching or innerlayer applications.
The advanced fine line direct imaging photoresist solution for IC substrate application.
Better adhesion, resolution and chemical resistance performance to overcome design challenges from CSP and BGA application
Next Generation T/E and P/E direct imaging photoresist.
Excellent tenting, chemical resistance and wind operation window enable higher yield
The advanced dry film photoresist for fine line HDI.
Fine line direct imaging photoresist solution for HDI mSAP application
Superior resolution capability for HDI pitch 70~100µm design (DI9000); Well balanced tenting and resolution capability to meet both Inner layer and outer layer design requirement (DI8600)
The advanced solution for fine line FPC design.
The advanced solution for tall copper pillar process in advanced packaging application.
Various thickness offering (50µm ~ 240µm) with better via resolution capability to meet future design challenges
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and solve the challenges of our time.