Conventional
DuPont™ Riston® dry film photoresist revolutionized the way printed circuit boards were fabricated when it was invented by DuPont more than 40 years ago.
The original dry film photoresist invented by DuPont is the industry standard for high yield, productivity, and ease of use in all imaging applications. DuPont™ Riston® products meet the industry demands for finer features, higher quality and lower cost in all types of plating and etching applications.
Circuit Imaging Materials for PCBs
-
Conventional
Conventional
Used in tenting, plating, akaline etching or innerlayer applications.
Riston® EtchMaster dry film photoresist is specifically designed as an acid etching film that delivers high yields in fine line applications. These photoresists provide excellent conformation using dry lamination and possess wide exposure, developing and stripping latitude.DuPont has developed the Riston® FX Series of photoresists to help fabricators address challenges of producing fine lines at high yields.Riston® GoldMaster is a fully aqueous resist that simplifies circuit board fabrication with special gold plating or nickel plating finishesUltra fast photospeed, high performance, and compatibility with conventional printed wiring board (PWB) processes are critical to help PWB fabricators optimize their LDI equipment investments.DuPont™ Riston® MultiMaster Series simplifies the manufacturing operation by eliminating the need for different films in your production line.Riston® PlateMaster was formulated to achieve consistently high yields by providing outstanding plated line uniformity, fine line resolution, and wide surface tolerance on direct metallization and panel plate.DuPont™ Riston® TentMaster provides excellent tenting capability, outstanding conformation, excellent resolution and remarkable tolerance to off-contact exposure.YieldMaster® Technology delivers optimum yields through the use of a specially developed thin resist, lamination system -
IC Substrates
IC Substrates
The advanced fine line direct imaging photoresist solution for IC substrate application.
Better adhesion, resolution and chemical resistance performance to overcome design challenges from CSP and BGA application.
-
Multi-layered Boards
Multi-layered Boards
Next Generation T/E and P/E direct imaging photoresist.
Excellent tenting, chemical resistance and wind operation window enable higher yield.
-
High Density Interconnect
High Density Interconnect
The advanced dry film photoresist for fine line HDI.
Fine line direct imaging photoresist solution for HDI mSAP application.
Superior resolution capability for HDI pitch 70~100µ m design (DI9000); Well balanced tenting and resolution capability to meet both Inner layer and outer layer design requirement (DI8600).
-
Flexible Circuits
Flexible Circuits
The advanced solution for fine line FPC design.
-
Advanced Package
Advanced Package
The advanced solution for tall copper pillar process in advanced packaging application.
Various thickness offering (50µ m ~ 240 µ m) with better via resolution capability to meet future design challenges.
We’re here to help.
We love to talk about how our electronics solutions can build business, commercialize products,
and solve the challenges of our time.