Ideas & Innovation

In this video, Joyce Yeh, regional sales manager for silicones, discusses DuPont's enhanced and expanded Optical Silicone Lab in Taoyuan, Taiwan.

Amid the breathless speculation about their mind-boggling possibilities, advanced computing and artificial intelligence applications face consequential but little-publicized performance hurdles.

Thermal runaway is a critical safety issue in electric vehicles, occurring when a battery cell experiences an uncontrollable temperature increase. Flaws in or damage to a battery can spike heat within the battery.

An insightful discussion featuring Mike Kwasny, business development manager at DuPont™, delves into technologies and innovations in electronics manufacturing featuring their unique material solutions, including their Kapton® film and Pyralux® laminate lines.

For more than five decades, DuPont has been at the forefront of material science, driving innovation and technological advancement with materials that have become synonymous with high-performance, reliability, and versatility.

Protection of Rover’s sophisticated equipment is crucial to the overall success of the mission.

Kapton® protects Jupiter Icy Moons Explorer by providing thermal insulation against extreme temperatures encountered during the mission.

DuPont PCMPSolv™ family performs advanced post-CMP cleaning with safer-by-design, green chemistries.

DuPont (NYSE:DD) Interconnect Solutions, part of the Electronics & Industrial business, announced today a multiyear contract with European power module manufacturer Semikron-Danfoss

DuPont (NYSE:DD) Interconnect Solutions, part of the Electronics & Industrial business, announced today a multiyear contract with European power module manufacturer Semikron-Danfoss who will integrate DuPont™ Pyralux® AP all-polyimide double-sided copper clad laminate into its eMPack® power modules to further enhance the capabilities of next-gen electric vehicles.

On November 16th, NASA successfully debuted its Space Launch System (SLS) rocket and the Orion capsule with a long-awaited launch from Kennedy Space Center, for what will be a more than month-long journey around the Moon.And as was the case for the first missions to the Moon, DuPont™ Kapton® polyimide films are onboard.

Product miniaturization is driving demand for substrate-like PCBs (SLPs) with finer patterns, requiring advanced photoresist materials.

Power distribution networks provide clean power for electronics. Using thin laminates for capacitance enables lighter end products with low signal noise

On the autonomous road ahead, DuPont is helping catalyze a more sustainable world. With materials that vastly improve connectivity, reliability and processing speed.

Laminates designed for flexible substrates have numerous potential applications in consumer and industrial products

Customers can continue to count on the same performance and durability of these high-performance silicone-based optical materials that they have come to trust.

DuPont's Pyralux® AP with RA copper offer an ideal flexible circuit option in the race to 5G.

DuPont laminates meet low-loss requirements for 5G and other high-data-rate applications, including IoT and autonomous cars.

Developing today’s complex high-tech electronic devices requires engineers to incorporate a range of materials with unique properties designed to help enable advanced functionality.

Flexible printed circuit boards offer solutions for design engineers who face challenges fitting more components into smaller devices.

Innovation has no boundaries and consistently create miniaturized, extremely high-quality PCBs.

To meet reliability standards, automotive PCBs migrate to solderless press-fit interconnections.

Dow reports on its progress with a plating on plastics process free from hexavalent chromium.

Why the automotive industry needs thermally stable PCB materials that withstand harsh environments.

Silver catalysts provide good catalytic activity, high electrical conductivity, modest cost, and good process stability, making PCB manufacturing a candidate for use

How DuPont addresses reliability demands and increased complexity of HDI and IC package substrates.

How to eliminate hexavalent chromium when plating acrylonitrile butadiene styrene on plastic.

How we overcame technical challenges to develop a flexible, high-performance automotive solution.

To comply with EU REACH legislation, boric acid replacement electrolytes for nickel are in development, with boric acid-free nickel plating already demonstrated.

Finer PCB Line/Space requirements are needed to deliver performance and DuPont has the solution.

This tutorial examines the concept of copper electroplating and how the process works, as well as its use in advanced packaging applications.

This tutorial examines the concept of copper through silicon via electroplating, which can increase reliability and decreases cost of subsequent process steps.

Reliable, cyanide-free ENIG surfaces delivers low gold porosity and excellent corrosion resistance.

Learn about Cu pillar requirements and processing considerations for advanced chip packaging.

The key structures for FOWLP and considerations for managing material properties.

How do PCB engineers fit all the necessary inputs and outputs on their boards while also ensuring reliable, long-term operation in demanding environments?

Colin Cameron discusses DuPont's biggest CMP portfolio expansion and its value in the marketplace.

Understanding material interactions helps PCB manufacturing control and interconnect reliability.

Increased electrification of vehicles is a growing technology trend, driven in large part by advances in lithium (Li)-ion cells and battery pack design.

How to get excellent electrical and mechanical connections between advanced PCBs and IC packages.

Ingenuity took its maiden voyage over the Martian soil on April 19, 2021.

Addresses the impact of higher switching frequency and faster voltage rise on motor insulation; shows eight-fold improvement over standard polyimide insulators.

In the first of two parts, we examine the backstory of FOWLP and the markets it serves.

The excellent thermal and mechanical properties of Kapton® polyimide film make it an ideal material for space applications.

Copper plating forms critical connections from horizontal RDLs through vertical pillars.

DuPont offers space satellite applications product selection guide to assist in the development of the next generation of space vehicles.

Inkjet printing improves etch capability to meet tight tolerances, complex patterns and more.

CD scaling, 3D structures and escalating costs drive advances in lithography and enabling materials

DuPont's Michelle Ho explains the role of CMP in 3D TSV processes and discusses CMP slurry design.

This tutorial examines the concept of copper electroplating and how the process works, as well as its use in advanced packaging applications.