Dow Electronic Materials
Connectivity
Connectivity provides insights into the materials that are enabling the next generation of electronic devices. Keep your edge with the latest information about recent developments, our product portfolio, and opinions and viewpoints from our industry experts.
Electronics & Imaging Director of Global Display Technology R&D Participates in Panel at 2018 China Display Technology Conference
Nov 01, 2018
At the 2018 China Display Technology Conference, Display Technologies executive Kathleen O’Connell sat on a panel of industry experts.
Rick Hemond, CMO, to Keynote SEMI Strategic Materials Conference 2018
Sep 19, 2018
The 2018 Strategic Materials Conference will focus on how materials are shaping the future of electronics. At the event, DowDupont’s Rick Hemond will deliver a keynote addressing role of electronic materials in a future connected world.
James Fahey, Business President, to Speak at SEMICON Taiwan 2018
Aug 29, 2018
DuPont Electronics & Imaging’s James Fahey and Rozalia Beica will give talks as part of highly anticipated programs set to take place during SEMICON Taiwan 2018. Programs include the IC60 Master Forum and the Advanced Packaging Technology Forum.
Display Technologies Specialty Silicones Team Shares Solutions at Guangzhou International Lighting Exhibition
Aug 09, 2018
At the 2018 Guangzhou International Lighting Exhibition, Dow Display Technologies Specialty Silicones Team exhibited solutions for chip-scale packaging.
Dow Michigan State Publish Jointly Authored OLED Paper
Jul 05, 2018
Joining forces with researchers from Michigan State, Dow has drawn on its expertise in OLED technology to jointly author a research paper on optimizing OLEDs’ performance.
Dow Experts Share Quantum Dot Technology Expertise at Recent Events
Jun 06, 2018
Leveraging Dow’s knowledge in display technology, company experts presented on the growing quantum dot market at two recent industry events.
ECTC 2018 Forges New Frontiers for Heterogeneous Integration
May 22, 2018
Dow Electronic Materials will be out in force at ECTC 2018 with our advanced electronics packaging experts and technology featured in multiple technical presentations covering fan-out wafer-level Packaging and more.
Dow Expert Presents Innovative CSP LED Material Solution to Epistar
May 20, 2018
Leveraging Dow’s expertise in LED materials, Epistar has partnered with us to extend its LED package manufacturing business to integrate chip-scale packages (CSPs) LED packaging. This partnership will present new solutions for LEDs and beyond.
Rozalia Beica To Provide the Material Supplier Perspective at ConFab 2018
May 17, 2018
Leading industry expert on semiconductor advanced packaging, Rozalia Beica, will represent industry suppliers in the ConFab 2018 Panel on Heterogeneous Integration on May 22. The ConFab program discusses the latest trends in semiconductor device manufacturing.
Extending OLED Device Lifetimes
Apr 26, 2018
OLEDs are experience strong market interest, but for even broader adoption, new technology is needed to achieve improvements in efficiency and lifetime. This research examines the effects of the molecular design of molecules within OLEDs and their connection to device lifetime.
Dow’s Asia CMP Center Celebrates Phase 4 Grand Opening
Apr 19, 2018
Dow Electronic Materials is expanding manufacturing operations for the production of pads for chemical mechanical planarization (CMP). Read on to see photos from the grand opening ceremony.
MICROFILL™ SFP Acid Copper Earns Dow its Ninth NPI Award in 10 Years
Apr 10, 2018
Industry awards are one of the strongest endorsements of a company’s products, especially when judged by peers. Dow is honored to receive it’s ninth PCD&F NPI Award this year for MICROFILL™ SFP Acid Copper.
2018 Outlook: A Vision for the Semiconductor Industry in China
Mar 20, 2018
Dow’s Shuji Ding-Lee talks with Semiconductor Manufacturing China about market dynamics and opportunities for semiconductor industry growth in China in 2018.
A market outlook: Will OLEDs Prevail in 2018 Display Markets?
Mar 15, 2018
The display market is in a period of transition, with LCD displays unstable, QDs a bit unknown and OLEDs seemingly in the driver’s seat. Dow’s Hwang shares his thoughts on this exciting market.
2018 Semiconductor Industry Outlook: Riding a Growth Trend
Mar 13, 2018
Dow’s Adam Manzonie gives his insight on what may extend the semiconductor industry’s growth in 2018. Overall product quality from material suppliers is key in 2018 to meet ever more stringent process control requirements.
Dow Litho and CMP Experts to Present Research at SEMICON China’s CSTIC
Mar 09, 2018
During the China Semiconductor Technology International Conference (CSTIC), representatives from Dow will share research on two topics: patterning materials for advanced 193nm immersion lithography, and the relationship between pad and slurry in CMP process optimization.
3D InCites: It’s Time to Get Serious About (Advanced Packaging for) 5G
Mar 08, 2018
Dow’s Rob Kavanagh discusses how advanced packaging will be a key asset for the development of 5G and the connectivity of all IoT devices. With the strict design and materials requirements for 5G, this proposes some challenges as well as opportunity for the semiconductor industry.
IMAPS DPC 2018 to Explore the Future of Advanced Packaging
Feb 26, 2018
IMAPS Device Packaging Conference is always at the forefront of semiconductor advanced packaging, and this year, it will look into the future. Check out Dow presentations from Dow experts during this year’s event.
Dow’s Peter Trefonas Named SPIE Fellow
Feb 26, 2018
Dow’s Peter Trefonas has been named a Fellow of SPIE, the international society for optics and photonics. Trefonas has been recognized for his achievements in design for manufacturing and compact modeling.
SPN Viewpoint 2018: The Fan-Out Conversation and Memory Growth Continue
Feb 15, 2018
In this look ahead to 2018, Rob Kavanagh discusses advanced packaging trends for 2018. With the memory market is on the rise, advanced packaging suppliers will be faced with more challenges.
Dow Prepares for the 2018 SPIE Advanced Lithography Conference
Jan 29, 2018
The SPIE Advanced Lithography conference is known for leading-edge technical research. In 2018, Dow will present on: improving performance through LWR analysis; the trade-offs of shot noise, LER and RLS; and innovative SiARC materials for implant lithography.
Boric Acid-Free Nickel Electroplating: Another REACH Challenge
Jan 22, 2018
EU REACH continues to identify and act potentially harmful substances; boric acid and borate salts may face increased restriction. Dow is developing boric acid replacement electrolytes for nickel, with boric acid-free nickel plating already demonstrated.
Dow and DuPont Previewed Future Display Technologies at IMID 2017
Dec 11, 2017
The possibilities for future display technologies are seemingly endless, from OLED to flexible to quantum dot. Together Dow and DuPont recently showcased how they are advancing high performance displays with the latest materials innovations.
Tailoring Copper Plating for Vias on IC Package Substrates
Nov 28, 2017
IC substrate manufacturers must innovate to be competitive in a landscape where feature dimensions continue to shrink. Copper plating chemistries optimized for IC substrates is one step manufacturers can take toward achieving their production goals.
Dow and DuPont to Exhibit at Productronica
Nov 02, 2017
With the merger of Dow and DuPont freshly completed, this year’s Productronica show, taking place Nov. 14-17 in Munich, Germany, represents the first opportunity to meet with the companies post-merger. So, what will change moving forward?
How Silver Catalysts Enhance PCB Manufacturing
Oct 31, 2017
Used in many applications, silver catalysts provide a balance of features: good catalytic activity, high electrical conductivity, modest cost, and good process stability. As such, they are increasingly being explored for use in PCB manufacturing.
Nitta Haas Receives Siltronic's Long-Term Partner Award for Polishing Materials
Oct 30, 2017
One of the strongest endorsements of a company’s performance and product quality is through industry supplier awards. Dow is proud to announce that its joint venture Nitta Haas has received Siltronic's Long-Term Partner Award for polishing materials.
Dow to Discuss Tin Whiskers and HDI Electroplating at 2017 IMPACT Conference
Oct 16, 2017
Examining the “IMPACT on Intelligent Everything,” this year's IMPACT conference will feature papers from Dow on the latest technological advances for tin whiskers and HDI electroplating.
Flexible PCBs for Smartphones Need New Metallization Processes
Sep 26, 2017
Consumers are demanding ever-more functionality and battery life from their smartphones, which is driving a need for flexible PCBs (FPCBs). This article looks at design considerations of metallization processes for FPCBs, which will enable future devices.
Press-Fit Solutions Address Future Automotive Reliability Requirements
Sep 06, 2017
Automotive electronics have long had to meet demanding reliability standards. As a result, automotive PCBs, with millions of through holes, are migrating towards solderless press-fit interconnection solutions as an alternative to soldering.
Innovation in CMP: The IKONIC™ Polishing Pad Platform
Aug 29, 2017
The IKONIC™ polishing pad platform has been Dow’s biggest CMP portfolio expansion in recent years, an innovation in advanced pad technology targeting multiple CMP applications. In this interview, Colin Cameron discusses the technology and its value in the marketplace.
Dow Litho Technologies Recognized with SMIC’s Best Technical Supplier Award
Aug 02, 2017
As a leading supplier of lithography consumables, customer satisfaction is a key performance metric. Dow’s Litho Technologies team is honored to be recognized with the Best Technical Supplier Award from SMIC, the largest semiconductor foundry in China.
Advanced Via Fill for HDI Applications
Aug 01, 2017
The smart phone market is driving improved via fill for HDI substrates, but it will also be needed for several emerging electronics markets. Continuous innovation in copper via fill is needed to meet new requirements.
The Future Is Cadmium-Free – Bright and Safe!
Jul 27, 2017
A key trend in electronics manufacturing is reducing the use of potentially harmful materials, such as cadmium. As a result, major global display manufacturers are moving away from cadmium-based QDs and committing to adopt cadmium-free QDs technology.
Inkjet Masking Reduces Gold Usage (and Cost) in Connectors
Jul 19, 2017
In the electrical connector industry, gold is frequently used because of its conductivity. Given its cost, there is a strong manufacturing need for a more effective masking procedure that can be carried out rapidly and offers improved resolution in reel-to-reel production.
Fine-tuning CMP Slurries for 3D TSV Processes
Jun 27, 2017
Chemical mechanical planarization (CMP) is a critical element of the 3D through silicon via (TSV) process flow for controlling wafer topography. Here, Dow’s Michelle Ho explains the role of CMP in TSV processes and discusses CMP slurry design for 3D TSVs.
Dow Electronic Materials’ James T. Fahey to Keynote Inaugural IMAPS SiP 2017 Conference
Jun 21, 2017
Dow’s James T. Fahey, Ph.D. will offer the afternoon keynote titled “The Evolution of Electronic Materials and the Information Age,” during the first-ever IMAPS System-in-Package conference. He will examine the semiconductor industry’s evolution and role of electronic materials.
Developing the Chinese Semiconductor Industry Ecosystem
May 25, 2017
With rapid growth occurring in the Chinese semiconductor industry, George Lu posits that the country needs to build out a complete supply chain to compete globally for advanced node manufacturing.
How Indium Enables Advanced Semiconductor Packaging
May 25, 2017
For a group of emerging electronics applications, high-temperature manufacturing processes pose significant challenges. In this interview, Dow’s experts explain the drivers for its latest SOLDERON plating chemistry leveraging the material properties of indium.
Dow to Showcase New Metallization Chemistries at ECTC 2017
May 19, 2017
Dow is a proud sponsor of ECTC 2017. At this year’s show, we will introduce SOLDERON™ BP Indium 1000 and INTERVIA™ 9000 Cu products. Learn how these new products expand our metallization portfolio for emerging advanced packaging applications.
Cleaning Up PCB Final Finish: Cyanide-Free ENIG Coatings
May 04, 2017
Although there are many potential roadblocks to cleaning up PCB final finishes, reliable cyanide-free ENIG surfaces now deliver low gold porosity and excellent corrosion resistance.
Role of Additives and Cu Purity in Advanced Package Reliability
May 02, 2017
Part 2 of our series on metallization examines the impact high density fan-out (HD FO), 2.5D and 3D packaging has on Cu plating requirements, and the role additives play in meeting requirements for advanced package reliability.
James Thackeray Named SPIE Fellow
Apr 13, 2017
Dr. Thackeray has been named a SPIE Fellow for his many achievements in lithography materials development over the past decade, many of which have contributed to enabling Moore’s law.
Market Drivers for Advanced Packaging Metallization
Apr 04, 2017
Advanced wafer-level packaging technologies hold the key to meeting the future needs of electronic devices. This requires advances in electronic materials, and advanced metallization technologies are no exception.
NPI Awards Honor COPPER GLEAM™ PPR-II Acid Cu Plating
Mar 22, 2017
The annual NPI Awards recognize best-of-breed new products. We're proud to announce that Dow’s COPPER GLEAM™ PPR-II Acid Cu was named best new plating technology for 2017.
Advancing the Thick PCB Manufacturing Process for 5G Infrastructure
Mar 20, 2017
The demand for thick PCBs is increasing, presenting a challenge and an opportunity for copper plating. Here, we look at how Dow is advancing the thick PCB manufacturing process to support the growth of 5G infrastructure
Dow to Present on Acidic CMP Slurry and Advanced Patterning at CSTIC
Mar 10, 2017
Dow will be at the China Semiconductor Technology International Conference with presentations on work from our CMP and lithography teams. One seminar will share findings on acidic ILD slurries, and the second will discuss lithographic materials when moving beyond 10nm.
Moving into China: Advances in Next-Generation Displays
Mar 07, 2017
China’s display market is growing rapidly, and if SID hosting its first-ever conference there is any indication, it is well on its way. Kathleen O’Connell offers an overview of her plenary session, explaining how multiple display technologies have room to succeed.
IMAPS Device Packaging Conference to Feature Next-Gen Materials and Trends
Feb 28, 2017
At this year’s IMAPS Device Packaging Conference, Dow experts will present sessions on Integrated Packaging and Substrate Technologies for Next-Generation Smart Devices, and Integration of Chemically Amplified Photoresist and High-Speed Copper Plating Products for Advanced Packaging Technologies.
Dow Weighs in on the Heterogeneous Integration Roadmap for 2017
Feb 21, 2017
This year, industry publication 3D InCites asked companies to comment on the new initiative for a Heterogeneous Integration Technology Roadmap for Semiconductors. Dow’s Rob Kavanagh shares his opinion in his 2017 outlook.
Advances in Patterning Materials and Processes at SPIE Advanced Lithography
Feb 20, 2017
Dow experts will present at this year’s SPIE Advanced Lithography as part of Advances in Patterning Materials and Processes Conference. Preview our presentations on embedded topcoat for EUV and soft spacer materials for advanced hole patterning.
2017 Outlook: Semiconductor Market Forecast Calls for Continued Collaboration
Feb 16, 2017
The semiconductor market forecast is strong for 2017. Dow's Colin Cameron discusses market drivers and the value of continued collaboration in an editorial for Solid State Technology.
New Nanorod LED Technology Responds to Light Input
Feb 15, 2017
Novel LED technology could create new possibilities for interacting with displays. Researchers from Dow Electronic Materials and the University of Illinois at Urbana-Champaign report on nanorod LED arrays that could be used to bring displays to life.
Will Fan-out Panel-Level Packaging Really Happen?
Feb 14, 2017
The advanced semiconductor packaging industry is considering a shift to fan-out panel-level packaging. Here, Dow’s Rozalia Beica and Monita Pau examine the challenges this new technology is facing.
Dow to Present at Inaugural Electron Devices Technology and Manufacturing Conference
Feb 09, 2017
The Electron Devices Technology Manufacturing Conference came about from the industry’s increased interest in how system integration improves device performance. This year, Dow offers its take on advanced materials and interconnect technologies for next-gen smart devices.
Why Converting Tin Electroplating Lines Makes Sense Now
Feb 07, 2017
Increasing concerns about toxicity and materials waste when tin-plating steel pose compelling reasons to convert existing PSA/ENSA plating lines to MSA, which provides benefits in cost, quality and environmental safety.
2017 Outlook: Lithography Materials Support Growth in China
Jan 31, 2017
Shuji Ding-Lee discusses the role lithography materials play in enabling next-gen technologies, as well as the growth of China’s IC market and requirements for materials suppliers.
Transitioning to Chromium-Free Etch Technology for Plating on Plastics
Jan 24, 2017
Dow reports on its progress towards a plating on plastics (POP) process free from hexavalent chromium to comply with REACH legislation
The Science Behind the Screen: LCD TVs Keep Getting Better
Jan 23, 2017
This post examines the benefits of the latest TFT technology for next-gen displays, specifically, the impact of organic insulator (NPL) materials, which are becoming indispensable for large, high-resolution, high-contrast LCD TVs.
Dow to Present on Packaging for Smart Devices at European 3D Summit
Jan 19, 2017
At the European 3D Summit, Dow Electronic Materials’ Rozalia Beica takes a deeper look at global trends driving advanced packaging, highlighting applications, today’s technologies and future trends.
2017 Outlook: Trends in Advanced Packaging and China’s Role
Jan 18, 2017
With 2017 just getting underway, Dow business leaders have been examining trends and challenges the semiconductor industry will face. Here, Rob Kavanagh reviews significant changes in the advanced packaging space over the past year and identifies trends that will influence 2017, including growth in China.
Examining Unique Plating Challenges of TSVs
Jan 17, 2017
This tutorial examines the concept of copper (Cu) through silicon via (TSV) electroplating, which, when done optimally, increases reliability and decreases cost of subsequent process steps.
2017 Outlook: Fan-out Wafer Level Packaging Goes Mainstream
Jan 13, 2017
Dow’s Rob Kavanagh joins other Dow leaders voicing their opinions on what’s coming in the semiconductor industry in the new year. In his 2017 outlook for Semiconductor Packaging News, Kavanagh looks at what’s needed to meet the challenges of fan-out water level packaging.
Dow’s Taiwan CMP Team Honored with Occupational Safety and Health Award
Dec 13, 2016
Dow Electronic Materials recently received the 2016 Taiwan Occupational Safety and Health Award for its Asia CMP Manufacturing and Technical Center. Read on for pictures from the award ceremony.
Copper Pillar Electroplating Tutorial
Dec 08, 2016
This tutorial examines the requirements and processing considerations for electroplated copper pillars used in advanced chip packaging applications. The key aspects of the plating process and the role of each in achieving the desired design and performance goals are described.
Performance Gains in CMP Slurry for Advanced Semiconductor Nodes
Dec 07, 2016
In a recent Solid State Technology article, Dow authors report on some of the complexities in chemical mechanical planarization (CMP) processes at advanced semiconductor nodes. Dow’s new OPTIPLANE™ slurry platform demonstrates excellent performance in meeting new process needs.
Autonomous Cars Are Driving the Next Gen of PCB Material Requirements
Nov 23, 2016
Cars increasingly rely on PCBs with chips that control everything from safety to passenger comfort and convenience. This is driving a need for highly reliable PCB materials that not only survive in a harsh environment, but also pass stringent thermal reliability tests that demonstrate long-term stability.
Copper Electroplating Fundamentals
Nov 22, 2016
This tutorial examines the concept of copper electroplating and how the process works. It also discusses its use in advanced packaging applications like the dual damascene process, TSV, copper pillars, and copper RDL, as well as how feature geometry as well as plating time affect how additives behave.
Evolution of LCDs, Part 1: BCS Technology
Nov 15, 2016
In this interview, Dow experts answer questions on the evolution of the LCD television market and how it is reshaping the future of displays. The interview then drills down into black column spacer (BCS) technology and its impact on cost and performance in the display market.
Dow Presentations Provide Gold, Silver, and Copper Solutions for IoT Devices at IMPACT-IIAC 2016
Nov 09, 2016
Dow was recently one of a few invited speakers outside academia to present at IMPACT-IIAC 2016. Aptly themed, “IMPACT on the Next Big Things,” the conference included panel sessions, industrial sessions and paper presentations on accelerating manufacturing and commercialization. Dow addressed four separate topics, all relating to gold, silver and copper solutions for IoT devices.
Technology Spotlight: IKONIC™ 4100 Polishing Pads, R&D 100 Awards Finalist
Nov 01, 2016
The IKONIC™ 4100 CMP pad series is a finalist for the 2016 R&D 100 Awards. Hear from our in-house experts about this innovative technology and how it is used in advanced chemical mechanical planarization (CMP). This is part two in a series profiling the R&D 100 Award Finalists from Dow Electronic Materials.
Technology Spotlight: CTO™ 2000 Trimming Overcoat Named an R&D 100 Finalist
Oct 27, 2016
The R&D 100 Awards are one of the highest honors in the research and design community. In this interview, we talk to Dow experts about the innovation behind one of this year’s finalists, CTO™ 2000 Trimming Overcoat, a solution for lithography in semiconductor manufacturing that enables patterning of smaller features than photolithography can do alone.
The Present and Future of OLED Materials Development
Oct 13, 2016
At the Global Materials Tech Fair in Seoul, Dow’s senior R&D manager Dai-Kyu Kim, recently delivered a lecture on the present and future of organic light emitting diode (OLED) materials development. Kim addressed the market outlook for OLEDs, including the evolution of OLED displays, and Dow’s contributions to the growth of the overall OLED display industry.
Dow to Present on the Challenges for Materials at the 14th International System-on-Chip Conference
Oct 05, 2016
At this year’s International System-on-Chip Conference, Dow Electronic Materials will present on the challenges facing SoC manufacturing from a chemistry perspective. Matthew Grandbois, Ph.D., will discuss how SoC devices have emerged to enable the continued evolution of electronic performance beyond what is achievable at 28nm, and Dow’s role in providing materials solutions for this challenging architectural landscape.
CMP Solutions for 10nm and Beyond
Oct 04, 2016
As manufacturers plan for 10nm and future nodes, requirements for chemical mechanical planarization (CMP) defect levels become increasingly challenging. Due to the stringent CMP requirements for front-end planarization of finFET devices, new materials will be needed to achieve high planarization efficiency and low defect rates, ensuring reliable CMP for the next generation of finFET devices.
Hear from Dow’s Experts at the ICPT CMP Conference in Beijing
Oct 03, 2016
The International Conference on Planarization/CMP Technology (ICPT) will be held in Beijing, China, October 17-19, 2016. Dow Electronic Materials will be well-represented at this leading CMP conference with session topics on materials and metrology, as well as poster presentations dedicated to some of our newest CMP pad and slurry technology.
Dow to Present at PRiME 2016: From TSV to Copper Pillars’ Transformative Technology
Sep 27, 2016
The Pacific Rim Meeting on Electrochemical and Solid-State Science (PRiME) conference brings together leading industry players to discuss a diverse blend of electrochemical and solid-state science and technology. This year, Dow Electronic Materials will present on how TSV and copper pillars are transforming semiconductor advanced packaging technology.
Peter Trefonas, 2016 Perkin Medal Recipient, Credits Chemistry for Enabling the Information Age
Sep 26, 2016
Peter Trefonas, Ph.D., received the Society of Chemical Industry (SCI) Perkin Medal on September 13, 2016, recognized as the highest honor given for outstanding work in applied chemistry in the United States. At the award ceremony, Trefonas spoke to how chemistry innovations enabled the Information Age.
OLED Displays Change Future Display Paradigms
Sep 14, 2016
The market for OLED displays is growing at a rapid pace, driven by smartphones, TVs, wearable devices, and more. This is driving new technology requirements to keep up with market trends. Demand for materials required in panel production is expected to increase along with the overall market growth.
Addressing CMP Slurry Market Drivers with the OPTIPLANE™ Platform, Part 2 of 2
Sep 13, 2016
Part two of this interview with Dow's Adam Manzonie examines Dow’s recently launched OPTIPLANE™ CMP slurry platform, focusing on the market drivers and steps to commercialization to deliver a total solution to meet 14nm chemical mechanical planarization (CMP) requirements.
Dow’s Peter Trefonas, Ph.D., Interviewed at SPIE Advanced Lithography
Sep 06, 2016
At the 2016 SPIE Advanced Lithography Conference, Peter Trefonas, Ph.D., was interviewed about his experiences in the field of photolithography. Throughout Trefonas’ 30+ years in the lithography field he has made significant contributions to photoresist technology and anti-reflective coatings.
Dow's Michelle Ho, Ph.D., to Discuss CMP Slurry for TSV at SEMICON Taiwan
Sep 01, 2016
The complexity of through-silicon via (TSV) geometry has increased the difficulty of global uniformity after the chemical mechanical planarization (CMP) process. At SEMICON Taiwan, Dow’s Michelle Ho, Ph.D., will address this in a presentation, "Expandable and Tunable CMP Slurry Platform for TSV Applications," as part of the CMP Forum on September 7, 2016.
Semiconductor Manufacturing Technologies from Dow Named Finalists for R&D 100 Awards
Aug 31, 2016
Two Dow technologies used in the process of fabricating integrated circuits have been named finalists in R&D Magazine’s prestigious 2016 R&D 100 Awards. Our CTO™ 2000 Trimming Overcoat enhances the photolithography process while IKONIC™ 4100 Polishing Pads optimize performance for chemical mechanical planarization (CMP).
Managing Material Properties of Fan-out Wafer-Level Packages
Aug 30, 2016
Advanced packages require specialty electronic materials to be made profitably and reliably. Fan-out wafer level packaging (FOWLP), has three key structures to consider: the dielectric layer, the redistribution layer (RDL), and Cu pillars. Part two of this two-part FOWLP series investigates these key structures and considerations for managing material properties.
Becoming REACH Compliant: Is your Pure Gold Pure Enough? Part 2 of 2
Aug 25, 2016
The need to become REACH compliant created demand for an arsenic-free, lead-free pure gold electroplating solution. Part 2 of this series addresses available alternatives to standard products, allowing manufacturers to be REACH compliant with pure gold wirebonding.
Dow’s Rozalia Beica to Present at the SEMICON Taiwan SiP Global Summit
Aug 23, 2016
The SiP Global Summit, which takes place during SEMICON Taiwan, is a two-day workshop devoted to advancements in system-in-package technologies. As part of this year’s novel material and equipment readiness segment of the program, Dow’s Rozalia Beica will tackle the challenges of both embedded technologies and fan-out wafer-level packaging.
Addressing CMP Slurry Market Drivers with the OPTIPLANE™ Platform, Part 1 of 2
Aug 17, 2016
In part one of this interview series, Dow's Adam Manzonie explains how the new OPTIPLANE™ CMP slurry platform meets requirements for 14nm node processes and below, which are much more sophisticated than those used for less advanced nodes. The OPTIPLANE™ CMP slurry family consists of Dow’s most advanced slurries for dielectric chemical mechanical planarization (CMP).
Are you ahead of the curve for REACH compliance? Part 1 of 2
Aug 16, 2016
REACH compliance is impacting the chemical industry worldwide, impacting everyone from raw material producers and suppliers to OEMs. In this two-part series, we will share Dow’s specific strategies and examples to ensure products are REACH compliant. Part 1 looks at the REACH landscape and key considerations for suppliers.
Inkjet Printing for Eco-friendly PCB Etch Processes
Aug 11, 2016
PCBs are becoming more complex and with smaller tolerances and manufacturers keep pace by improving process capability. Drivers, especially price pressures, have driven improvements in efficiency and yield for etch processes. These same trends are driving interest in inkjet printing, which also offers a more environmentally friendly approach over traditional methods.
Investigating Organic Photovoltaic Cells for Renewable Energy Conversion
Aug 02, 2016
Organic materials have significant potential for the next-generation of high-tech applications like solar cells, LEDs and displays. This paper explores our work with the University of Minnesota to improve understanding of how pure active materials must be to meet industry specifications and optimize device performance.
Chemical Trimming Overcoat Enhances Multiple Pattern Lithography
Jul 29, 2016
Extreme ultraviolet (EUV) technology is solidly positioned on the semiconductor manufacturing roadmap, but interim technologies are needed to extend 193nm immersion lithography until EUV enters production. Multiple patterning is one such technology, and this article discusses a novel spin-on chemical trim overcoat formulation that simplifies the advanced patterning process.
Via Fill’s Role in the Evolution of Portable Electronics
Jul 21, 2016
Cellphones have evolved considerably in the past 20 years, both in terms of form and function, as the market has exploded globally. Development of cellphone technology has been a major driver for advances in semiconductor packaging and printed circuit board (PCB) design, and via fill plays an important role.
The State of EUV Lithography: A Materials Primer
Jul 19, 2016
Extreme ultraviolet (EUV) lithography is the most promising of the post-optical lithography patterning technologies to enable continued shrink, keeping the semiconductor industry on the path of Moore’s law. Dow’s two Litho University℠ video tutorials on EUV are a great place to start learning the fundamentals of EUV technology.
Fan-Out Wafer-Level Packaging and Its Material Evolutions
Jul 06, 2016
Recently, FOWLP has become one of the hottest advanced packaging technologies. New market drivers, namely the Internet of Things, that require miniaturized system-in-package solutions are bringing FOWLP to the forefront. Part one of this two-part series, we examine the back-story of FOWLP and the markets it serves.
Dow’s Peter Trefonas, Ph.D., to Be Honored with SCI Perkin Medal
Jun 28, 2016
Trefonas will be honored with an SCI Perkin Medal, the highest honor given for outstanding work in applied chemistry. He is being recognized for his expertise in chemistries and materials used in photolithography processes and for creating materials that have enabled production of smaller feature sizes in semiconductor manufacturing.
Dow Electronic Materials Taiwan Site Holds Groundbreaking Ceremony for Expansion Project
Jun 23, 2016
Dow Taiwan recently hosted a groundbreaking ceremony at its Asia CMP Manufacturing and Technical Center to mark the beginning of construction. Dow will increase production capacity of materials for conventional and next-generation chemical mechanical planarization (CMP) pads in a multi-functional building close to the business’ existing facility in Hsinchu Science Park.
Dow’s Litho Technologies Team Recognized by Fairchild Semiconductor
Jun 20, 2016
Dow Electronic Materials has been recognized as Fairchild Semiconductor's Chemical Supplier of the Year for its materials and service for the microlithography process. The award was recently presented to representatives from Dow’s Litho Technologies team in Marlborough, MA.
Dow’s Phillip Hustad, Ph.D., Featured in American Chemical Society “What Chemists Do” Series
Jun 14, 2016
Dow's Phillip Hustad, Ph.D., discusses his chemistry career in this video from the American Chemical Society's "What Chemists Do" video series. Watch the video to hear highlights from throughout his career including his graduate studies, his work synthesizing polyethylene at the industrial level, and advice for those getting started in the field.
Enabling Advanced PCB HVM with Nickel-Free Copper Plating
Jun 09, 2016
Advanced PCBs for high-density packaging require copper metal interconnects for both horizontal traces as well as vertical micro-via holes. Cost-effective manufacturing requires that fine-line traces and micro-via holes be formed using the same HVM processes. Learn how nickel-free electroless copper plating chemistry enables fine-pattern plating needed in advanced IC substrates.
Dow Electronic Materials Launches OPTIPLANE™ CMP Slurry Platform for Advanced Semiconductor Manufacturing
Jun 08, 2016
Advanced semiconductor manufacturing continues to follow the projections of Moore’s Law, making process specifications increasingly stringent with a greater need than ever for defect reduction. In response to these emerging requirements, Dow Electronic Materials recently launched its new OPTIPLANE™ slurry platform for chemical mechanical planarization (CMP) for advanced semiconductor devices.
Enhancing Advanced PCB Performance with Corrosion-Resistant Electroless Nickel
May 24, 2016
PCBs are shipped with a “final finish,” a solderable surface that offers excellent electrical and mechanical connections to IC packages. This tutorial examines current technology, including OSP, ENIG, and immersion tin and silver, and demonstrates how high-phos electroless nickel helps meet the needs of the most advanced PCBs powering today’s electronic devices.
Dow CMP to Present at Inaugural Strategic Materials Conference Korea
May 05, 2016
Dow is honored to participate in the inaugural Strategic Materials Conference Korea. We will discuss the need for advanced CMP materials to achieve scaling as the industry moves below 10 nm, and address the challenges faced by semiconductor materials suppliers for next-generation manufacturing.
Does Electrodeposited Indium have a Future in Advanced Packaging?
May 04, 2016
Copper (Cu) pillars are important interconnect structures used in advanced IC packaging, requiring cost-effective solder capping materials, and lower bonding temperature is emerging as an important driver. This article provides an overview of “Enabling Low-Temperature Bonding in Advanced Packaging using Electrodeposited Indium,” to be presented at the 2016 ECTC sponsored by IEEE.
2016 Dow Korea Award Winner Recognized for Work on OLED Efficiency
May 03, 2016
The Dow Korea Award program honors outstanding work in electronic materials to support the research activities of science and engineering students in Korea. This year’s winner, Seoul National University Ph.D. candidate Kwon-Hyeon Kim was recognized for his work on OLED efficiency, demonstrating EQEs of 35.6% with horizontally oriented dipole moments.
Extending Lithography Capability with Specialty Materials, Part 2 of 2
Apr 25, 2016
Improvements with pattern resolution capabilities can no longer keep up with dimension scaling for semiconductor integrated circuits. Now facing lithography challenges at the nanoscale topography of advanced CMOS finFET, Part 2 of this series examines the issues associated with removing photoresist from advanced finFET structures post-ion-implantation.
Fast, High-purity Cu Plating Enables Next-Gen Devices
Apr 20, 2016
Fan-out wafer-level packages (FOWLP) are poised for adoption in consumer mobile devices while cloud servers are driving the need for 3DIC packages. Copper (Cu) plating forms critical connections from horizontal redistribution layers (RDLs) through vertical pillars. Learn more about Dow’s approach to optimal Cu plating, as presented at the 2016 IMAPS Device Packaging Conference.
Join Dow at the 2016 Symposium on Polymers for Microelectronics
Apr 14, 2016
Dow Electronic Materials will present some of its latest advances in dielectric materials for advanced packaging at this year’s IMAPS Symposium on Polymers for Microelectronics, taking place in Winterthur, Delaware, April 25-27, 2016. This year’s conference is focused on innovations driving a smart and interconnected world.
Extending Lithography Capability with Specialty Materials, Part 1 of 2
Apr 05, 2016
The industry is facing several lithography challenges related to scaling, due largely to limitations with patterning resolution. This two-part series offers an overview of the challenges presented by further scaling and how extensions to lithography capability allow for patterning of smaller features.
Is REACH Regulation changing the products you use?
Mar 29, 2016
With REACH regulations now reaching the 10-year mark, manufacturers globally are well on the road to compliance. No longer limited to the EU, many other countries are adopting similar requirements. In this article, we look at Dow’s efforts to meet REACH benchmarks.
Wafer Bumping Considerations: The importance of the interface between metal layers
Mar 15, 2016
Many new assembly processes are in development, including ultra thinning of wafers to enable stacked die, package-on-package (PoP) and ultra-thin packages. Wafer-level packaging (WLP) to improve reliability and I/O count, ball pitch and routability are also imperative. This post provides an introduction on materials considerations for the interface between metal layers in wafer bump structures.
Region Specific Enhancement of Quantum Dot Emission Using Interleaved Two-Dimensional Photonic Crystals
Mar 08, 2016
This paper presents a photonic crystal design incorporating two interleaved regions, each with distinct periods in orthogonal directions adjacent to a thin polymer film containing colloidal semiconductor nanocrystals, such as quantum dots. The structure enables simultaneous resonant coupling of ultraviolet excitation photons to the quantum dots and visible quantum dot emission at two different wavelengths to efficiently extract photons normal to the photonic crystal surface.
Join Dow at the 2016 IMAPS Device Packaging Conference
Mar 03, 2016
Dow Electronic Materials will be participating in this year’s IMAPS Device Packaging Conference with other industry leaders to move forward a number of advanced packaging technologies. Dow will present two papers in the Interposer and 3D-IC & Packaging track and contribute to a third presented by Fraunhofer IZM.
Dow’s Litho and CMP Teams to Present at CSTIC 2016
Mar 02, 2016
Dow is a proud participant in this year’s CSTIC conference, where we will present papers about some of our recent work in lithography and chemical mechanical planarization (CMP) technology. The conference will be held March 13-14, 2016 in conjunction with SEMICON China in Shanghai.
Lead-free Materials Are Critical to Sustainable Manufacturing
Feb 15, 2016
Dow Electronic Materials has been actively developing a line of lead-free advanced packaging materials that help manufacturers comply with RoHS and REACH, while ensuring a level of reliability equivalent to lead-based materials. This article introduces "Lead-free solder electroplating products for advanced bumping technologies," first presented at IMAPS Device Packaging Conference.
Double-heterojunction nanorods, a step towards electroluminescent quantum dot displays
Feb 09, 2016
As semiconductor heterostructures play critical roles in today’s electronics and optoelectronics, the introduction of active heterojunctions can impart new and improved capabilities that will enable the use of solution-processable colloidal semiconductor nanocrystals such as quantum dots and heterojunction nanorods in future devices.
Meeting the Challenges of Copper Plating for Advanced High Layer Count PCBs
Feb 02, 2016
A wide variety of routers, switches, and storage units power today’s Internet. These devices must evolve, offering higher functionality per unit area and relying on state of the art chipsets. This article explores the challenges of manufacturing to meet emerging PCB requirements using Cu plating for advanced high-layer count PCBs.
Learn from Dow’s Experts at SPIE Lithography
Jan 26, 2016
The 2016 SPIE Advanced Lithography Conference will be held February 21-25, 2016 in San Jose, CA. The Dow team will be presenting four sessions and one poster presentation as part of the Advances in Patterning Materials and Processes conference track, and we hope to see you there!
2016 Outlook: Trends Driving Packaging Materials Development
Jan 25, 2016
If 2015 goes down in history as the year of 3D stacked memory, then it looks like 2016 may be remembered as the year for the first big adoptions of FOWLP. Dow’s Rob Kavanagh takes a look at the year ahead and the trends driving advanced packaging materials development.
Advanced Packaging Materials Adding More Value to ICs
Jan 22, 2016
Dow Electronic Materials’ Rob Kavanagh takes a look at the state of materials for advanced packaging in his 2016 Outlook now featured on Solid State Technology.
Dow Recognized by TSMC with Supplier Excellence Award for CMP Materials
Dec 17, 2015
Dow Electronic Materials is honored to have received a 2015 Supplier Excellence Award from TSMC for performance in the development and delivery of materials for chemical mechanical planarization (CMP).
Nanorods and Other Dimensionally Confined Nanomaterials for Optoelectronics
Dec 15, 2015
Dimensionally Confined Nanomaterials (DCNs) enable optoelectronics due to high luminescence and control of the spectral output. The market for DCN is expected to have high growth rate and value. Working in collaboration with the University of Illinois, Dow is conducting research to differentiate DCNs to improve its device performance IP.
Silver Plating Technology Driving 200°C Automotive Apps
Nov 30, 2015
Automotive applications have a unique set of requirements for electronics, not the least of which is high temperature. Silver plating connectors offers many benefits: electrical conductivity, visual appearance, solderability and corrosion resistance. This article examines how Dow R&D overcame technical challenges to develop a flexible, high-performance solution for automotive applications.
Dow’s SOLDERON™ Tin-Silver Plating Chemistry Takes Home an Oscar of Innovation
Nov 23, 2015
It’s been a banner year for SOLDERON™ BP TS 6000 Tin-Silver Plating Chemistry, which was recently awarded an R&D 100 Award, presented by R&D Magazine in a ceremony at Caesar’s Palace in Las Vegas. This “Oscar of Innovation” takes its place in Dow Electronic Materials’ trophy case, next to the 2015 Edison Award.
Litho University℠: DBARC Technology 101
Nov 18, 2015
DBARC offers a viable alternative to BARC for semiconductor manufacturing, as the relentless pursuit of Moore’s law has stretched lithography to its very limits in the attempt to scale to smaller nodes. In this video, Jim Cameron, Ph.D., provides an overview of DBARC and its application for advanced lithography patterning processes.
How Laminate Dielectrics Enable Glass Substrates for Advanced Packaging Applications
Nov 16, 2015
The adoption of glass substrates as a replacement for silicon in interposer integration requires interconnect solutions that reduce the size of signal routing and so impose new demands on the dielectric materials. At IMAPS 2014, Dow presented its solution in a paper titled, “Photopatternable Laminate BCB Dielectric.”
Behind the Scenes of Dow’s Finalists for the 2015 R&D 100 Awards: Part 3 | IKONIC™ 2000 CMP Polishing Pads
Nov 12, 2015
This is the third installment of Dow’s R&D 100 Awards interview series, which delves into the three Dow Electronic Materials products named as finalists. In this interview, Dow’s Marty DeGroot explains the innovations behind the technology, and how the IKONIC™ CMP polishing pad series is addressing next-generation customer requirements.
Meeting the Horizontal Electroless Copper Plating Challenge with an Ionic Palladium Catalyst Process
Nov 02, 2015
Packaging density of electronic circuits continues to increase and must be defect-free after electroless plating. New innovations are required to meet changing demands on reliability and the increased complexity of HDI and IC package substrate boards. This post introduces Dow’s approach to horizontal electroless Cu plating to meet these challenges.
Developing CMP Consumables for New IC Materials
Oct 20, 2015
The semiconductor industry has pushed the limits of miniaturization such that new materials will need to be integrated into more complex structures to continue further scaling. Given the vast number of materials interactions, CMP R&D requires a systems perspective to comprehend the optimal combination of pad and slurry for a target application.
Behind the Scenes of Dow’s Finalists for the 2015 R&D 100 Awards: Part 2 | SOLDERON™ BP TS 6000 Tin-Silver
Oct 20, 2015
This series interviews Dow experts who were pivotal to the development and commercialization of innovative chemistries that are finalists for the 2015 R&D 100 Awards. In Part 2, Wataru Tachikawa talks about the changing requirements in advanced wafer-level packaging (AWLP) and how SOLDERON™ BP TS 6000 Tin-Silver meets them.
Sustainable and Cost-Effective Tin Electroplating
Oct 14, 2015
Turnkey tin electroplating technologies, which for decades have served the world’s demand for safe food in cans, have hit a snag due to the increased cost of tin and environmental concerns about the release of toxic byproducts. This article describes how methane sulfonic acid (MSA), an efficient and benign chemistry, is becoming the alternative.
Inner-layer Copper Reliability of Electroless Copper Processes
Oct 08, 2015
The metallization process is at the core of PCBs. Used to make the drilled holes conductive, metallization creates the interconnections necessary to achieve functionality. This article examines common issues related to PCBs and the importance of understanding material interactions to achieve manufacturing control and ultimately interconnect reliability.
Behind the Scenes of Dow’s Finalists for the 2015 R&D 100 Awards: Part 1 | MICROFILL™ THF Electrolytic Copper
Sep 28, 2015
This series interviews Dow experts who were pivotal to the development and commercialization of innovative chemistries that are finalists for the 2015 R&D 100 Awards. In Part 1, Maria Rzeznik talks about the changing requirements in high-density PCBs and how MICROFILL™ THF-100 Electrolytic Copper addresses them.
Join Dow’s CMP Team at ICPT 2015
Sep 25, 2015
Dow is proud to be a sponsor and participant at the 2015 International Conference on Planarization/CMP Technology (ICPT) taking place in Chandler, Ariz. Sept. 30 to Oct. 2, 2015. This year, we will be giving three presentations during the conference, which are previewed in this short article.
Enhanced Methods for Specialty Chemicals Purification and OLED Device Fundamentals
Sep 09, 2015
The growing Active Matrix OLED (AMOLED) market calls for specialty chemicals that require purification. This interview with researchers from Dow and the University of Minnesota details the work being done on this through a University Partnership Initiative, generating knowledge to support high-performance OLED display development and next-gen OLED offerings.
CMP Cost Reduction by Optimal Pad Selection
Aug 25, 2015
Yield loss is widely recognized the greatest cost in high-volume manufacturing (HVM) of commercial integrated circuit IC devices, and so significant cost-reduction comes from improving device yields. This article explores how CMP pad design can reduce defects, leading to higher wafer yields.
Three Dow Electronic Materials Technologies Named Finalists for 2015 R&D 100 Awards
Aug 19, 2015
Dow was recently highlighted as a leading innovator with 21 products selected as finalists for the 2015 R&D 100 Awards. Three of these are technologies developed by Dow Electronic Materials as market-focused solutions and commercialized in the last year.
Self-Priming Low Stress Aqueous Developable Benzocyclobutene Photodielectric Materials for Advanced Wafer Level Packaging
Aug 18, 2015
Photoimageable polymeric dielectric materials are in need of modification to meet the warpage targets for thinned 300mm wafers used in fan-out wafer level packages, where lower residual stress is required. This presentation discusses a prototype dielectric material developed by Dow’s Advanced Packaging Technologies group that meets these requirements.
Addressing Changing Via Fill Requirements for the New Generation HDI PCBs in Industry-Leading Fine-pitch Applications
Aug 17, 2015
Today’s high density interconnect (HDI) printed circuit boards (PCBs) increase the functionality of a circuit board while utilizing less area. This article looks at how to solve the challenge of copper (Cu) via-filling HDI structures that meet requirements for complete via-fill of laser micro-vias while simultaneously plating through holes to enable advanced features in electronic devices.
Next-Generation Copper, Nickel and Lead-Free Metallization Products for Next-Generation Devices and Applications
Aug 15, 2015
Meeting the challenging requirements of next-generation devices destined for Internet of Things applications necessitates metallization products that can address fine feature sizes and geometries of today’s advanced chip and package designs. This presentation details how Dow Electronic Materials has optimized its family of advanced electronics packaging metallization products.
Development of Highly Efficient Organic Light Emitting Diodes with Novel Light Emission Mechanism
Aug 11, 2015
OLED displays are growing rapidly and have a wide variety of market applications. In conjunction with Kyung Hee University in Korea, Dow is researching a novel emitter system to enable the manufacture of high-performance, large flat panel displays. In this interview, Dr. Lee explains the work in progress and potential benefits.
Material Considerations for the IOT and Heterogeneous Integration, Part 2 of 2
Aug 06, 2015
The semiconductor industry has been going through rapid and radical change in the past few years. Mobile and wireless computing, and the IoT call for taking other elements into consideration. Part 2 of this series looks at the new device technologies needed to enable the IoT.
Effect of π-conjugated Bridges of TPD-based Medium Bandgap Conjugated Copolymers for Efficient Tandem Organic Photovoltaic Cells
Aug 04, 2015
Since 2011, Dow has hosted the Dow Korea Award to support research activities by science and engineering students and recognize outstanding papers in electronic materials. This year’s award winning paper is presented here, demonstrating research showing that a reduction in efficiency that occurs in the course of high temperature processing can be overcome to some degree.
Chromium-Free Etch Technology for Plating on Plastic
Jul 24, 2015
Regulatory changes are affecting the plating on plastic (POP) industry. Manufacturers who plate acrylonitrile butadiene styrene (ABS) as part of their POP manufacturing work flow need a way to eliminate the use of hexavalent chromium before the September 21, 2017 sunset date set by REACH.
How Do Tin-Silver Caps Influence Reliability of Copper Pillar Applications?
Jul 23, 2015
As packaging technologies must address the higher performance and increased functionality of today’s electronic devices, traditional C4 bumps are reaching their limits. The industry is turning to Cu pillars as a solution for fine pitch bumping, with tin-silver caps becoming the solder capping material of choice. In this interview, Dr. Jianwei Dong explains why.
3D TSV Plating and Bumping: Rising to the Challenge
Jul 22, 2015
3D integration using through silicon vias (TSVs) promises a fundamental shift for current multi-chip integration and packaging approaches, but it brings more difficulties in Cu electroplating. This piece explores process and material optimization efforts to enable volume manufacturing of 3D ICs.
Addressing Challenges to Enhance OLED Device Performance
Jul 07, 2015
Challenges related to OLED device performance—such as further optimizing lifetime and efficiency—remain. This article looks at recent work exploring the way molecules pack in the glass film during deposition from the gas phase, which may offer a new tool for enhancing device performance.
Litho UniversitySM: Directed Self-Assembly 101
Jul 07, 2015
Nanotechnology researchers have been studying self-assembly to enable development of next-generation electronic devices, and directed self-assembly (DSA) is actively being explored for use in the lithography process of semiconductor manufacturing. In this series of videos, Dow’s Dr. Phil Hustad will take you on a journey through the amazing world of DSA.
CMP Pad Selection for 28nm Node and Beyond
Jul 07, 2015
The “one-size-fits-all” approach to CMP processing is no longer viable; a tunable platform of products is required to meet manufacturers ever-evolving and more technically challenging manufacturing needs. The IKONIC™ CMP pad platform is uniquely positioned to address future IC fabrication requirements because of the tunability of its materials properties.
Solving Data Center Reliability Challenges through Packaging
Jul 07, 2015
The semiconductor industry is approaching a point where 2.5D and 3D integration technologies will be required to achieve the performance, bandwidth and storage required of next-generation data centers and mobile devices. In this piece, Wataru Tachikawa explores how the entire ecosystem is rolling up its sleeves and working to overcome the remaining challenges.
Materials Considerations for Next-Gen Semiconductor Architectures, Part 1 of 2
Jul 07, 2015
The semiconductor industry has been going through some rapid and radical metamorphoses over the past few years, which means taking new elements into consideration, such as battery size and life, security and integration of MEMS, sensors and RF devices. What does this mean for the consumable suppliers to the semiconductor industry?
SOLDERON™ BP TS 6000 Tin-Silver Honored by the Prestigious Edison Awards for Getting the Lead Out
Jul 07, 2015
In common vernacular, “getting the lead out” is a phrase that means, “hurry up!” In the electronics industry, the expression is taken quite literally, with manufacturers needing to find a lead-free alternative to tin-lead solders for wafer bumping processes. Tin-silver plating chemistry has stepped in to fill the role.