Bringing Solutions to Life at the Platform Level

December 18, 2019

 
 
 
DuPont and BOE partner on first-ever exclusive BOE Innovation Day

Parts 1 and 2 of this blog series shared insights from High Reliability Segment Market Leader Matt Guise recorded during the recent IPC APEC EXPO in San Diego. Part 1 focused on enabling customer success while Part 2 looked at market trends and DuPont’s technology portfolio. In the final installment in this series, Guise brings the technologies to life, highlighting three applications that have (or will) benefit from DuPont’s high reliability portfolio and collaborative approach to product development.

In the first example, Guise looks at high reliability applications like submarines, UAVs and ground vehicles where one might not think space or weight are major considerations, but it turns out that they really are. He presents a solution co-developed with TTM Technologies to replace wire harnesses and cabling with Pyralux® flex circuit solutions that drive increased performance, increased reliability and have much smaller space requirements – attendees even got to feel the difference for themselves with samples of both products on site.

For his second application, Guise looked at another packaging application co-developed with NextFlex and Boeing to solve a conformal antenna challenge in 787 aircraft. This use case requires a solution that delivers performance in a very challenging form factor where the solution has to fit the space, be surface agnostic and perform when bent. NextFlex has built a flexible x-band antenna array leveraging DuPont’s Pyralux solutions that is extremely promising.

In his third application example, Guise previews a thermal conductive substrate solution currently in development for power electronics and discrete devices. First, he illustrates a typical package using ceramic for thermal management (along with other components) and explains that ceramic – while widely used today – has always been challenged by cracking at high temperatures or under thermal stress. The alternative that is being developed is a simplified system that leverages a conductive Kapton® film enabled by Tempurion® organic direct bond copper (ODBC) placed between the Kapton and the heat sink. He goes on to explain that the film inside the copper and heat sink is 4 times as conductive as standard Kapton and delivers a 100x performance benefit compared to ceramic in terms of survivability. While not yet on the market, the solution is under evaluation by Tier 1 and OEM customers.

Learn all about these applications for DuPont’s high reliability technology in the video below.