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High-Density Interconnect (HDI)
Meeting the specialized needs of HDI boards
DuPont’s long history of expertise in copper electroplating allows us to meet the needs of the next generation of high-density PCBs. We provide highly conformal copper plating that will enable any of your HDI designs, no matter how complex, to perform well.
Choose DuPont as your materials solutions partner to provide:
- Cost-effective conformal copper plating for HDI boards
- Metallization that will enhance board reliability
- Multiple plating options tailored to your specific application
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Meeting Miniaturization Demands
Miniaturization of electronic devices is driving the need for highly reliable metallization that can connect ever smaller metal lines and vias on advanced HDI boards. Designs include laser-drilled blind microvias as well as through holes with high aspect ratios. Both types of vias need to be filled completely without depositing excess copper
Metallization Materials for PCBs
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High Density Interconnect
High Density Interconnect
Our highly conformal copper plating will enable any HDI design to perform well.
View DetailsDesigned for both horizontal and vertical processing of innerlayers
Formulated to provide improved physical properties and produce exceptionally fine-grain and low-stress deposits
A self-accelerating electroless copper bath designed for use in the horizontal mode, and can be used in either high or low build applications
A black oxide product that promotes innerlayer adhesion of copper in multi-layer circuit board fabrication
An Ionic Catalyst and a Tartrate-based Electroless copper that meet demands on interconnect density and reliability
A solvent swell product designed to enhance the resin texturing and smear removal of high Tg materials in the subsequent Circuposit™ Promoter stage
Offering excellent through-hole throwing power combined with excellent conformal microvia plating
Delivering high plating efficiency to improve productivity and reduce cost
Designed to lower board manufacturer's ENIG process costs, while maintaining optimum reliability and performance
A high phosphorous Electroless Nickel specifically formulated for use in combination with the Aurolectroless™ SMT 520 Immersion Gold process
Designed for reliable through-hole plating of printed circuit boards and used to plate boards with thickness up to approximately 5mm at high rates with excellent surface distribution, leveling and throwing power
Providing complete fill at lower copper thickness, reduced dimples and skip-rate, and improved surface appearance
Providing enhanced microvia filling, with simultaneous through-hole plating capability, at previously unattainable surface thicknesses
Offering excellent blind microvia fill with lower copper surface thickness
Providing through hole fill of inner core layers for IC-Substrate PCB with improved reliability, and both electrical and thermal conductivity
Formulated to work with both vertical in-line and horizontal equipment used to fabricate HDI and IC Substrates
An acidic tin plating solution which produces smooth, fine-grained deposits over a wide plating range
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Multi-Layered Boards
Multi-Layered Boards
Metallization to enable high-performance rigid PCBs.
View DetailsDesigned for both horizontal and vertical processing of innerlayers
Formulated to provide improved physical properties and produce exceptionally fine-grain and low-stress deposits
A self-accelerating electroless copper bath designed for use in the horizontal mode, and can be used in either high or low build applications
A black oxide product that promotes innerlayer adhesion of copper in multi-layer circuit board fabrication
A solvent swell product designed to enhance the resin texturing and smear removal of high Tg materials in the subsequent Circuposit™ Promoter stage
Eliminating the need for a separate accelerator step, saving space, increasing process speed, and improving reliability and quality
Designed for use with periodic pulse reverse (PPR) plating
Delivering high plating efficiency to improve productivity and reduce cost
Designed for reliable through-hole plating of printed circuit boards and used to plate boards with thickness up to approximately 5mm at high rates with excellent surface distribution, leveling and throwing power
Designed to lower board manufacturer's ENIG process costs, while maintaining optimum reliability and performance
A UV-curable acrylic hybird ink that redefines the etching process for PCB innerlayer fabrication
Providing complete fill at lower copper thickness, reduced dimples and skip-rate, and improved surface appearance
Providing enhanced microvia filling, with simultaneous through-hole plating capability, at previously unattainable surface thicknesses
Formulated for use in combination with Duraposit™ electroless nickel baths and Aurolectroless™ immersion gold baths to provide uniform ENEPIG deposits for final finishing of PCBs
A wide range of supporting products for developing, etching and stripping processes that compliment our photo imageable products
Uniform thin coatings provide improved surface conformance, improved fine-line etching performance, as well as lower costs and reduced waste
Formulated to work with both vertical in-line and horizontal equipment used to fabricate HDI and IC Substrates
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IC Substrates
IC Substrates
Copper plating solutions for substrates in all types of advanced packages.
View DetailsA self-accelerating electroless copper bath designed for use in the horizontal mode, and can be used in either high or low build applications
An Ionic Catalyst and a Tartrate-based Electroless copper that meet demands on interconnect density and reliability
Improving adhesion of the subsequent metal layer for next-generation dielectric materials
Providing uniform copper deposits by ensuring even absorbtion catalyst on dielectric materials
A high throw electroless copper system that enables reliable coverage in microvias while minimizing surface copper deposits, thereby enhancing etching capability.
Designed to lower board manufacturer's ENIG process costs, while maintaining optimum reliability and performance
A high phosphorous Electroless Nickel specifically formulated for use in combination with the Aurolectroless™ SMT 520 Immersion Gold process
Providing complete fill at lower copper thickness, reduced dimples and skip-rate, and improved surface appearance
Providing enhanced microvia filling, with simultaneous through-hole plating capability, at previously unattainable surface thicknesses
Offering excellent blind microvia fill with lower copper surface thickness
Offering excellent laser micro-via fill and pattern plate uniformity of flip-Chip substrates
Providing through hole fill of inner core layers for IC-Substrate PCB with improved reliability, and both electrical and thermal conductivity
Formulated for use in combination with Duraposit™ electroless nickel baths and Aurolectroless™ immersion gold baths to provide uniform ENEPIG deposits for final finishing of PCBs
Formulated to work with both vertical in-line and horizontal equipment used to fabricate HDI and IC Substrates
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Flexible Circuits
Flexible Circuits
Copper plating to meet the demands of flexible PCBs.
View DetailsA patented 3-step desmear to effectively clean, condition and activate hole-wall surfaces.
A self-accelerating electroless copper bath designed for use in the horizontal mode, and can be used in either high or low build applications
Processes especially designed for operation in vertical and horizontal equipment respectively
Producing uniform crystal grain structure to provide a smooth plated surface on rolled copper
A copper plating process producing uniform, bright deposits of high ductility and tensile strength in accelerated plating times.
Designed to lower board manufacturer's ENIG process costs, while maintaining optimum reliability and performance