Printed Circuit Boards - HDI
The evolution of Moore’s Law and miniaturization of electronic devices continues to drive the need for innovative solutions for the manufacture of complex HDI boards.
Dow Electronic Materials is focused on developing high reliability metallization processes that address the challenges of next generation HDI applications.
Innerlayer Bonding
Alternative Oxide
Making Holes Conductive
Desmear
Electroless Copper for MSAP
Electrolytic Copper
- MICROFILL™ EVF Vertical DC Micro Via Filling Process
- MICROFILL™ EVF 15 Via Fill
- MICROFILL™ LVF 3 ACID COPPER
- MICROFILL™ THF-100 Electrolytic Copper
- COPPER GLEAM™ HV-101 Electroplating
- COPPER GLEAM™ HV-606 Electroplating
- COPPER GLEAM™ ST-920 Acid Copper
- ELECTROPOSIT™ 1500 Acid Copper
- RONACLEAN™ EVP-210S Cleaner
Electrolytic Tin
Final Finishes
Electroless Nickel and Immersion Gold