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High-Density Interconnect (HDI)
Meeting the specialized needs of HDI boards
DuPont’s long history of expertise in copper electroplating allows us to meet the needs of the next generation of high-density PCBs. We provide highly conformal copper plating that will enable any of your HDI designs, no matter how complex, to perform well.
Choose DuPont as your materials solutions partner to provide:
- Cost-effective conformal copper plating for HDI boards
- Metallization that will enhance board reliability
- Multiple plating options tailored to your specific application
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Meeting Miniaturization Demands
Miniaturization of electronic devices is driving the need for highly reliable metallization that can connect ever smaller metal lines and vias on advanced HDI boards. Designs include laser-drilled blind microvias as well as through holes with high aspect ratios. Both types of vias need to be filled completely without depositing excess copper
Metallization Materials for PCBs
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High Density Interconnect
High Density Interconnect
Our highly conformal copper plating will enable any HDI design to perform well.
View DetailsDesigned for both horizontal and vertical processing of innerlayersFormulated to provide improved physical properties and produce exceptionally fine-grain and low-stress depositsA self-accelerating electroless copper bath designed for use in the horizontal mode, and can be used in either high or low build applicationsA black oxide product that promotes innerlayer adhesion of copper in multi-layer circuit board fabricationA solvent swell product designed to enhance the resin texturing and smear removal of high Tg materials in the subsequent Circuposit™ Promoter stageNew generation SAP electroless copper for IC substrateOffering excellent through-hole throwing power combined with excellent conformal microvia platingThe advanced solution for high speed direct current copper pillar technologyDelivering high plating efficiency to improve productivity and reduce costDesigned to lower board manufacturer's ENIG process costs, while maintaining optimum reliability and performanceA high phosphorous Electroless Nickel specifically formulated for use in combination with the Aurolectroless™ SMT 520 Immersion Gold processDesigned for reliable through-hole plating of printed circuit boards and used to plate boards with thickness up to approximately 5mm at high rates with excellent surface distribution, leveling and throwing powerProviding complete fill at lower copper thickness, reduced dimples and skip-rate, and improved surface appearanceOffering excellent blind microvia fill with lower copper surface thicknessNovel pattern plating solution for advanced package substratesProviding through hole fill of inner core layers for IC-Substrate PCB with improved reliability, and both electrical and thermal conductivityAn acidic tin plating solution which produces smooth, fine-grained deposits over a wide plating range -
Multi-Layered Boards
Multi-Layered Boards
Metallization to enable high-performance rigid PCBs.
View DetailsDesigned for both horizontal and vertical processing of innerlayersFormulated to provide improved physical properties and produce exceptionally fine-grain and low-stress depositsA self-accelerating electroless copper bath designed for use in the horizontal mode, and can be used in either high or low build applicationsA black oxide product that promotes innerlayer adhesion of copper in multi-layer circuit board fabricationA solvent swell product designed to enhance the resin texturing and smear removal of high Tg materials in the subsequent Circuposit™ Promoter stageEliminating the need for a separate accelerator step, saving space, increasing process speed, and improving reliability and qualityNew generation SAP electroless copper for IC substrateThe advanced solution for high speed direct current copper pillar technologyDesigned for use with periodic pulse reverse (PPR) platingDelivering high plating efficiency to improve productivity and reduce costDesigned for reliable through-hole plating of printed circuit boards and used to plate boards with thickness up to approximately 5mm at high rates with excellent surface distribution, leveling and throwing powerDesigned to lower board manufacturer's ENIG process costs, while maintaining optimum reliability and performanceA high phosphorous Electroless Nickel specifically formulated for use in combination with the Aurolectroless™ SMT 520 Immersion Gold processA UV-curable acrylic hybird ink that redefines the etching process for PCB innerlayer fabricationProviding complete fill at lower copper thickness, reduced dimples and skip-rate, and improved surface appearanceNovel pattern plating solution for advanced package substratesFormulated for use in combination with Duraposit™ electroless nickel baths and Aurolectroless™ immersion gold baths to provide uniform ENEPIG deposits for final finishing of PCBsA wide range of supporting products for developing, etching and stripping processes that compliment our photo imageable productsUniform thin coatings provide improved surface conformance, improved fine-line etching performance, as well as lower costs and reduced waste -
IC Substrates
IC Substrates
Copper plating solutions for substrates in all types of advanced packages.
View DetailsA self-accelerating electroless copper bath designed for use in the horizontal mode, and can be used in either high or low build applicationsImproving adhesion of the subsequent metal layer for next-generation dielectric materialsNew generation SAP electroless copper for IC substrateNovel pattern plating solution for advanced package substratesProviding through hole fill of inner core layers for IC-Substrate PCB with improved reliability, and both electrical and thermal conductivityFormulated for use in combination with Duraposit™ electroless nickel baths and Aurolectroless™ immersion gold baths to provide uniform ENEPIG deposits for final finishing of PCBs -
Flexible Circuits
Flexible Circuits
Copper plating to meet the demands of flexible PCBs.
View DetailsA patented 3-step desmear to effectively clean, condition and activate hole-wall surfaces.A self-accelerating electroless copper bath designed for use in the horizontal mode, and can be used in either high or low build applicationsNew generation SAP electroless copper for IC substrateProcesses especially designed for operation in vertical and horizontal equipment respectivelyThe advanced solution for high speed direct current copper pillar technologyProducing uniform crystal grain structure to provide a smooth plated surface on rolled copperA copper plating process producing uniform, bright deposits of high ductility and tensile strength in accelerated plating times.Designed to lower board manufacturer's ENIG process costs, while maintaining optimum reliability and performance