DuPont's wealth of metallization options allows us to provide you with a metallization that will be compatible with your chosen dielectric. We keep up with trends in IC packaging and understand the need for cost-effective solutions that enhance package reliability. DuPont offers:
We specialize in pure copper plating for more reliable interconnect on substrates for ball grid arrays (BGA) and chip scale packages (CSP). High throwing power leads to excellent thickness distribution. Even coverage over substrates with complex geometry ensures the highest degree of reliability.
Choose DuPont as your materials solutions partner to give you:
Copper plating solutions for substrates in all types of advanced packages.View Details
Metallization to enable high-performance rigid PCBs.View Details
Our highly conformal copper plating will enable any HDI design to perform well.View Details
Copper plating to meet the demands of flexible PCBs.View Details