Printed Circuit Boards - IC Substrate
Dow Electronic Materials is your ideal partner to provide a total solution for metalizing finer line and space patterns on next generation IC substrates.
The continuous miniaturization of circuit features on packaging substrates makes it increasingly challenging for manufacturers to deliver high performance and highly reliable substrates at high yields. Dow Electronic Materials has a dedicated group of experienced scientists and engineers to deliver innovative and cost effective solutions to address these challenges.
Desmear Solution for SAP
Electroless Copper for SAP
Electroless Copper for Core
Electroless Copper for MSAP
Electroless Palladium
Electroless Nickel and Immersion Gold