Metallization for IC Substrates
Copper plating solutions to enable reliable IC packaging
DuPont's wealth of metallization options allows us to provide you with a metallization that will be compatible with your chosen dielectric. We keep up with trends in IC packaging and understand the need for cost-effective solutions that enhance package reliability. DuPont offers:
- Desmear surface treatments that promote better adhesion
- Electroless copper seed deposition to make the dielectric layer conductive
- Electrolytic plating for via fill, copper pillar, and redistribution layers (RDL)
We specialize in pure copper plating for more reliable interconnect on substrates for ball grid arrays (BGA) and chip scale packages (CSP). High throwing power leads to excellent thickness distribution. Even coverage over substrates with complex geometry ensures the highest degree of reliability.
Choose DuPont as your materials solutions partner to give you:
- The wet chemistry advantage of low cost and high performance
- A choice of standard plating options or individualized recipes tailored to optimize your device performance
- A complete solution for all IC substrate metallization needs
Supporting IC Substrate Development with Advanced Materials Technology
Metallization Materials for PCBs
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IC Substrates
IC Substrates
Copper plating solutions for substrates in all types of advanced packages.
Improving adhesion of the subsequent metal layer for next-generation dielectric materialsAdd subscription: Providing through hole fill of inner core layers for IC-Substrate PCB with improved reliability, and both electrical and thermal conductivityThe advanced solution for high speed direct current copper pillar technology.
Formulated for use in combination with Duraposit™ electroless nickel baths and Aurolectroless™ immersion gold baths to provide uniform ENEPIG deposits for final finishing of PCBs -
Multi-Layered Boards
Multi-Layered Boards
Metallization to enable high-performance rigid PCBs.
The 3350-1 electroless copper bath is formulated to provide improved physical properties and produce exceptionally fine-grain, low-stress deposits, which yield enhanced hole-wall coverage and excellent adhesion even on the most demanding high-performance substrates.Circuposit™ 4500 Electroless Copper is a self-accelerating electroless copper bath designed for use in the horizontal mode, and can be used in either high or low build applications.A black oxide product that promotes innerlayer adhesion of copper in multi-layer circuit board fabrication.
A solvent swell product designed to enhance the resin texturing and smear removal of high Tg materials in the subsequent Circuposit™ Promoter stage.
Eliminating the need for a separate accelerator step, saving space, increasing process speed, and improving reliability and quality.
New generation SAP electroless copper for IC substrate.
The advanced solution for high speed direct current copper pillar technology.
Delivering high plating efficiency to improve productivity and reduce cost.
Designed to lower board manufacturer's ENIG process costs, while maintaining optimum reliability and performanceA high phosphorous Electroless Nickel specifically formulated for use in combination with the Aurolectroless™ SMT 520 Immersion Gold processFormulated for use in combination with Duraposit™ electroless nickel baths and Aurolectroless™ immersion gold baths to provide uniform ENEPIG deposits for final finishing of PCBsA wide range of supporting products for developing, etching and stripping processes that compliment our photo imageable products -
High Density Interconnect
High Density Interconnect
Our highly conformal copper plating will enable any HDI design to perform well.
The 3350-1 electroless copper bath is formulated to provide improved physical properties and produce exceptionally fine-grain, low-stress deposits, which yield enhanced hole-wall coverage and excellent adhesion even on the most demanding high-performance substrates.Circuposit™ 4500 Electroless Copper is a self-accelerating electroless copper bath designed for use in the horizontal mode, and can be used in either high or low build applications.A black oxide product that promotes innerlayer adhesion of copper in multi-layer circuit board fabrication.
A solvent swell product designed to enhance the resin texturing and smear removal of high Tg materials in the subsequent Circuposit™ Promoter stage.
New generation SAP electroless copper for IC substrate.
Specifically formulated for use with copper anodes and direct current (DC) rectification, offers excellent through-hole throwing power combined with excellent conformal microvia plating.
The advanced solution for high speed direct current copper pillar technology.
Designed to lower board manufacturer's ENIG process costs, while maintaining optimum reliability and performanceAdd subscription: Providing through hole fill of inner core layers for IC-Substrate PCB with improved reliability, and both electrical and thermal conductivity -
Flexible Circuits
Flexible Circuits
Copper plating to meet the demands of flexible PCBs.
A patented 3-step desmear to effectively clean, condition and activate hole-wall surfaces.Circuposit™ 4500 Electroless Copper is a self-accelerating electroless copper bath designed for use in the horizontal mode, and can be used in either high or low build applications.Processes especially designed for operation in vertical and horizontal equipment respectivelyDesigned to lower board manufacturer's ENIG process costs, while maintaining optimum reliability and performanceTape Automated Bonding
Immersion tin for TAB and COF manufacturing.
Supporting products for pre and post treatment to enhance the performance of the TAB/COF products.Leading immersion tin products providing exceptional performance with low running cost.
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