Metallization for Printed Circuit Boards
IC Substrates
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Metallization for IC Substrates
Copper plating solutions to enable reliable IC packaging
DuPont's wealth of metallization options allows us to provide you with a metallization that will be compatible with your chosen dielectric. We keep up with trends in IC packaging and understand the need for cost-effective solutions that enhance package reliability. DuPont offers:
- Surface treatments that promote better adhesion
- Electroless copper seed deposition to make the dielectric layer conductive
- Electrolytic plating for via fill, copper pillar, and redistribution layers (RDL)
We specialize in pure copper plating for more reliable interconnect on substrates for ball grid arrays (BGA) and chip scale packages (CSP). High throwing power leads to excellent thickness distribution. Even coverage over substrates with complex geometry ensures the highest degree of reliability.
Choose DuPont as your materials solutions partner to give you:
- The wet chemistry advantage of low cost and high performance
- A choice of standard plating options or individualized recipes tailored to optimize your device performance
- A complete solution for all IC substrate metallization needs
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Solutions for IC Substrates
IC packaging is becoming more complex, with IC substrates needing to provide a reliable base for applications including wafer-level packaging and system-in-package (SiP) designs. Feature sizes continue to decrease, and complex geometries pose a challenge for achieving uniform coverage of dielectric and metal layers.
IC substrate metallization needs to be highly conductive and optimized for different dielectric materials. Some applications do well with standard metallization chemistries, while the most challenging, cutting-edge designs benefit from an individualized approach where the chemistry is adjusted as needed to maximize performance.
Metallization Materials for PCBs
- IC Substrates
- Multi-Layered Boards
- High Density Interconnect
- Flexible Circuits
IC Substrates
Copper plating solutions for substrates in all types of advanced packages.
Circuposit™ 4000 Horizontal Electroless Copper
A self-accelerating electroless copper bath designed for use in the horizontal mode, and can be used in either high or low build applications
Circuposit™ 6500 Electroless Copper Process
An Ionic Catalyst and a Tartrate-based Electroless copper that meet demands on interconnect density and reliability
Circuposit™ 7800 Vertical Desmear Process for SAP
Improving adhesion of the subsequent metal layer for next-generation dielectric materials
Circuposit™ 7900 Electroless Copper for SAP
Providing uniform copper deposits by ensuring even absorbtion catalyst on dielectric materials
Circuposit™ ADV 8550 Electroless Copper Process
A high throw electroless copper system that enables reliable coverage in microvias while minimizing surface copper deposits, thereby enhancing etching capability.
Duraposit™ Electroless Nickel & Aurolectroless™ Immersion Gold
Designed to lower board manufacturer's ENIG process costs, while maintaining optimum reliability and performance
Duraposit™ SMT-820 Electroless Nickel
A high phosphorous Electroless Nickel specifically formulated for use in combination with the Aurolectroless™ SMT 520 Immersion Gold process
Microfill™ EVF 15 Via Fill
Providing complete fill at lower copper thickness, reduced dimples and skip-rate, and improved surface appearance
Microfill™ EVF Via Fill
Providing enhanced microvia filling, with simultaneous through-hole plating capability, at previously unattainable surface thicknesses
Microfill™ LVF 3 Acid Copper
Offering excellent blind microvia fill with lower copper surface thickness
Microfill™ LVF IV Acid Copper
Offering excellent laser micro-via fill and pattern plate uniformity of flip-Chip substrates
Microfill™ THF-100 Electrolytic Copper Bath
Providing through hole fill of inner core layers for IC-Substrate PCB with improved reliability, and both electrical and thermal conductivity
Pallamerse™ SMT 2000 Electroless Palladium
Formulated for use in combination with Duraposit™ electroless nickel baths and Aurolectroless™ immersion gold baths to provide uniform ENEPIG deposits for final finishing of PCBs
Ronaclean™ EVP-210S Cleaner
Formulated to work with both vertical in-line and horizontal equipment used to fabricate HDI and IC Substrates
Multi-Layered Boards
Metallization to enable high-performance rigid PCBs.
View DetailsCircubond™ 2200 Plus Innerlayer Bonding Process
Designed for both horizontal and vertical processing of innerlayers
Circuposit™ 3000-1 Electroless Copper
Formulated to provide improved physical properties and produce exceptionally fine-grain and low-stress deposits
Circuposit™ 4000 Horizontal Electroless Copper
A self-accelerating electroless copper bath designed for use in the horizontal mode, and can be used in either high or low build applications
Circuposit™ 484 Black Oxide & Converter
A black oxide product that promotes innerlayer adhesion of copper in multi-layer circuit board fabrication
Circuposit™ Hole Prep 4126 Sweller
A solvent swell product designed to enhance the resin texturing and smear removal of high Tg materials in the subsequent Circuposit™ Promoter stage
Circuposit™ LC-9100 Electroless Copper Process
Eliminating the need for a separate accelerator step, saving space, increasing process speed, and improving reliability and quality
Copper Gleam™ CuPulse Plus PPR
Designed for use with periodic pulse reverse (PPR) plating
Copper Gleam™ HV-101 & HV-606 Electrolytic Copper
Delivering high plating efficiency to improve productivity and reduce cost
Duraposit™ Electroless Nickel & Aurolectroless™ Immersion Gold
Designed to lower board manufacturer's ENIG process costs, while maintaining optimum reliability and performance
Electroposit™ 1500 Acid Copper
Designed for reliable through-hole plating of printed circuit boards and used to plate boards with thickness up to approximately 5mm at high rates with excellent surface distribution, leveling and throwing power
Lithojet™ 223 Inkjet Resist
A UV-curable acrylic hybird ink that redefines the etching process for PCB innerlayer fabrication
Microfill™ EVF 15 Via Fill
Providing complete fill at lower copper thickness, reduced dimples and skip-rate, and improved surface appearance
Microfill™ EVF Via Fill
Providing enhanced microvia filling, with simultaneous through-hole plating capability, at previously unattainable surface thicknesses
Pallamerse™ SMT 2000 Electroless Palladium
Formulated for use in combination with Duraposit™ electroless nickel baths and Aurolectroless™ immersion gold baths to provide uniform ENEPIG deposits for final finishing of PCBs
Develop, Etch and Strip Imaging Products
A wide range of supporting products for developing, etching and stripping processes that compliment our photo imageable products
Photoposit™ Liquid Photoresist
Uniform thin coatings provide improved surface conformance, improved fine-line etching performance, as well as lower costs and reduced waste
Ronaclean™ EVP-210S Cleaner
Formulated to work with both vertical in-line and horizontal equipment used to fabricate HDI and IC Substrates
High Density Interconnect
Our highly conformal copper plating will enable any HDI design to perform well.
View DetailsCircubond™ 2200 Plus Innerlayer Bonding Process
Designed for both horizontal and vertical processing of innerlayers
Circuposit™ 3000-1 Electroless Copper
Formulated to provide improved physical properties and produce exceptionally fine-grain and low-stress deposits
Circuposit™ 4000 Horizontal Electroless Copper
A self-accelerating electroless copper bath designed for use in the horizontal mode, and can be used in either high or low build applications
Circuposit™ 484 Black Oxide & Converter
A black oxide product that promotes innerlayer adhesion of copper in multi-layer circuit board fabrication
Circuposit™ 6500 Electroless Copper Process
An Ionic Catalyst and a Tartrate-based Electroless copper that meet demands on interconnect density and reliability
Circuposit™ Hole Prep 4126 Sweller
A solvent swell product designed to enhance the resin texturing and smear removal of high Tg materials in the subsequent Circuposit™ Promoter stage
Copper Gleam ST-920 Acid Copper
Offering excellent through-hole throwing power combined with excellent conformal microvia plating
Copper Gleam™ HV-101 & HV-606 Electrolytic Copper
Delivering high plating efficiency to improve productivity and reduce cost
Duraposit™ Electroless Nickel & Aurolectroless™ Immersion Gold
Designed to lower board manufacturer's ENIG process costs, while maintaining optimum reliability and performance
Duraposit™ SMT-820 Electroless Nickel
A high phosphorous Electroless Nickel specifically formulated for use in combination with the Aurolectroless™ SMT 520 Immersion Gold process
Electroposit™ 1500 Acid Copper
Designed for reliable through-hole plating of printed circuit boards and used to plate boards with thickness up to approximately 5mm at high rates with excellent surface distribution, leveling and throwing power
Microfill™ EVF 15 Via Fill
Providing complete fill at lower copper thickness, reduced dimples and skip-rate, and improved surface appearance
Microfill™ EVF Via Fill
Providing enhanced microvia filling, with simultaneous through-hole plating capability, at previously unattainable surface thicknesses
Microfill™ LVF 3 Acid Copper
Offering excellent blind microvia fill with lower copper surface thickness
Microfill™ THF-100 Electrolytic Copper Bath
Providing through hole fill of inner core layers for IC-Substrate PCB with improved reliability, and both electrical and thermal conductivity
Ronaclean™ EVP-210S Cleaner
Formulated to work with both vertical in-line and horizontal equipment used to fabricate HDI and IC Substrates
Ronastan™ EC-1 NPE Free Electrolytic Tin
An acidic tin plating solution which produces smooth, fine-grained deposits over a wide plating range
Flexible Circuits
Copper plating to meet the demands of flexible PCBs.
View DetailsCircuposit™ 200 MLB Process
A patented 3-step desmear to effectively clean, condition and activate hole-wall surfaces
Circuposit™ 4000 Horizontal Electroless Copper
A self-accelerating electroless copper bath designed for use in the horizontal mode, and can be used in either high or low build applications
Conductron™ DP/DP-H Direct Plate Process
Processes especially designed for operation in vertical and horizontal equipment respectively
Copper Gleam™ HGX Electrolytic Copper Plate
Producing uniform crystal grain structure to provide a smooth plated surface on rolled copper
Copper Gleam™ HS-200 Electrolytic Copper
A copper plating process producing uniform, bright deposits of high ductility and tensile strength in accelerated plating times
Duraposit™ Electroless Nickel & Aurolectroless™ Immersion Gold
Designed to lower board manufacturer's ENIG process costs, while maintaining optimum reliability and performance