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Metallization for IC Substrates
Copper plating solutions to enable reliable IC packaging
DuPont's wealth of metallization options allows us to provide you with a metallization that will be compatible with your chosen dielectric. We keep up with trends in IC packaging and understand the need for cost-effective solutions that enhance package reliability. DuPont offers:
- Surface treatments that promote better adhesion
- Electroless copper seed deposition to make the dielectric layer conductive
- Electrolytic plating for via fill, copper pillar, and redistribution layers (RDL)
We specialize in pure copper plating for more reliable interconnect on substrates for ball grid arrays (BGA) and chip scale packages (CSP). High throwing power leads to excellent thickness distribution. Even coverage over substrates with complex geometry ensures the highest degree of reliability.
Choose DuPont as your materials solutions partner to give you:
- The wet chemistry advantage of low cost and high performance
- A choice of standard plating options or individualized recipes tailored to optimize your device performance
- A complete solution for all IC substrate metallization needs
Metallization Materials for PCBs
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IC Substrates
IC Substrates
Copper plating solutions for substrates in all types of advanced packages.
View DetailsA self-accelerating electroless copper bath designed for use in the horizontal mode, and can be used in either high or low build applicationsAn Ionic Catalyst and a Tartrate-based Electroless copper that meet demands on interconnect density and reliabilityImproving adhesion of the subsequent metal layer for next-generation dielectric materialsProviding uniform copper deposits by ensuring even absorbtion catalyst on dielectric materialsA high throw electroless copper system that enables reliable coverage in microvias while minimizing surface copper deposits, thereby enhancing etching capability.Designed to lower board manufacturer's ENIG process costs, while maintaining optimum reliability and performanceA high phosphorous Electroless Nickel specifically formulated for use in combination with the Aurolectroless™ SMT 520 Immersion Gold processProviding complete fill at lower copper thickness, reduced dimples and skip-rate, and improved surface appearanceProviding enhanced microvia filling, with simultaneous through-hole plating capability, at previously unattainable surface thicknessesOffering excellent blind microvia fill with lower copper surface thicknessOffering excellent laser micro-via fill and pattern plate uniformity of flip-Chip substratesProviding through hole fill of inner core layers for IC-Substrate PCB with improved reliability, and both electrical and thermal conductivityFormulated for use in combination with Duraposit™ electroless nickel baths and Aurolectroless™ immersion gold baths to provide uniform ENEPIG deposits for final finishing of PCBsFormulated to work with both vertical in-line and horizontal equipment used to fabricate HDI and IC Substrates -
Multi-Layered Boards
Multi-Layered Boards
Metallization to enable high-performance rigid PCBs.
View DetailsDesigned for both horizontal and vertical processing of innerlayersFormulated to provide improved physical properties and produce exceptionally fine-grain and low-stress depositsA self-accelerating electroless copper bath designed for use in the horizontal mode, and can be used in either high or low build applicationsA black oxide product that promotes innerlayer adhesion of copper in multi-layer circuit board fabricationA solvent swell product designed to enhance the resin texturing and smear removal of high Tg materials in the subsequent Circuposit™ Promoter stageEliminating the need for a separate accelerator step, saving space, increasing process speed, and improving reliability and qualityDesigned for use with periodic pulse reverse (PPR) platingDelivering high plating efficiency to improve productivity and reduce costDesigned to lower board manufacturer's ENIG process costs, while maintaining optimum reliability and performanceDesigned for reliable through-hole plating of printed circuit boards and used to plate boards with thickness up to approximately 5mm at high rates with excellent surface distribution, leveling and throwing powerA UV-curable acrylic hybird ink that redefines the etching process for PCB innerlayer fabricationProviding complete fill at lower copper thickness, reduced dimples and skip-rate, and improved surface appearanceProviding enhanced microvia filling, with simultaneous through-hole plating capability, at previously unattainable surface thicknessesFormulated for use in combination with Duraposit™ electroless nickel baths and Aurolectroless™ immersion gold baths to provide uniform ENEPIG deposits for final finishing of PCBsA wide range of supporting products for developing, etching and stripping processes that compliment our photo imageable productsUniform thin coatings provide improved surface conformance, improved fine-line etching performance, as well as lower costs and reduced wasteFormulated to work with both vertical in-line and horizontal equipment used to fabricate HDI and IC Substrates -
High Density Interconnect
High Density Interconnect
Our highly conformal copper plating will enable any HDI design to perform well.
View DetailsDesigned for both horizontal and vertical processing of innerlayersFormulated to provide improved physical properties and produce exceptionally fine-grain and low-stress depositsA self-accelerating electroless copper bath designed for use in the horizontal mode, and can be used in either high or low build applicationsA black oxide product that promotes innerlayer adhesion of copper in multi-layer circuit board fabricationAn Ionic Catalyst and a Tartrate-based Electroless copper that meet demands on interconnect density and reliabilityA solvent swell product designed to enhance the resin texturing and smear removal of high Tg materials in the subsequent Circuposit™ Promoter stageOffering excellent through-hole throwing power combined with excellent conformal microvia platingDelivering high plating efficiency to improve productivity and reduce costDesigned to lower board manufacturer's ENIG process costs, while maintaining optimum reliability and performanceA high phosphorous Electroless Nickel specifically formulated for use in combination with the Aurolectroless™ SMT 520 Immersion Gold processDesigned for reliable through-hole plating of printed circuit boards and used to plate boards with thickness up to approximately 5mm at high rates with excellent surface distribution, leveling and throwing powerProviding complete fill at lower copper thickness, reduced dimples and skip-rate, and improved surface appearanceProviding enhanced microvia filling, with simultaneous through-hole plating capability, at previously unattainable surface thicknessesOffering excellent blind microvia fill with lower copper surface thicknessProviding through hole fill of inner core layers for IC-Substrate PCB with improved reliability, and both electrical and thermal conductivityFormulated to work with both vertical in-line and horizontal equipment used to fabricate HDI and IC SubstratesAn acidic tin plating solution which produces smooth, fine-grained deposits over a wide plating range -
Flexible Circuits
Flexible Circuits
Copper plating to meet the demands of flexible PCBs.
View DetailsA patented 3-step desmear to effectively clean, condition and activate hole-wall surfaces.A self-accelerating electroless copper bath designed for use in the horizontal mode, and can be used in either high or low build applicationsProcesses especially designed for operation in vertical and horizontal equipment respectivelyProducing uniform crystal grain structure to provide a smooth plated surface on rolled copperA copper plating process producing uniform, bright deposits of high ductility and tensile strength in accelerated plating times.Designed to lower board manufacturer's ENIG process costs, while maintaining optimum reliability and performance