Metallization For Printed Circuit Boards

Multi-Layered Boards

Metallization for Multi-layer Boards

Enabling high-performance rigid boards

DuPont’s metallization and imaging products act as key enabling technologies for the high-end multi-layer PCBs that reside in computers, smartphones, and automobiles. As you increase layer count, you can’t afford to compromise reliability. We offer a variety of products that will allow your products to perform their best. Materials include:

  • Desmearing materials to swell the dielectric for more efficient and effective etching
  • Stable electroless copper to ensure enhanced coverage for through-hole plating
  • DC plating of electrolytic copper to uniformly fill vias in high-layer-count boards

Choose DuPont as your materials solutions partner to:

  • Enhance the reliability of your high-layer-count boards
  • Create easy-to-use solutions that streamline the PCB metallization process
  • Find the right combination of materials optimized for your application
  • The number of layers in PCBs has increased to the point where etching and depositing metal can be a performance-limiting step. Holes are narrower in diameter and deeper than ever before, making via preparation, coating, and filling critical. High-speed, high-frequency applications are especially sensitive. Metallization needs to be tailored to the dielectric material and the board geometry to ensure reliable performance of HAR boards with small feature sizes.

Metallization Materials for PCBs

  • Multi-Layered Boards
  • IC Substrates
  • High Density Interconnect
  • Flexible Circuits

Multi-Layered Boards

Metallization to enable high-performance rigid PCBs.

Circubond™ 2200 Plus Innerlayer Bonding Process

Designed for both horizontal and vertical processing of innerlayers


Circuposit™ 3000-1 Electroless Copper

Formulated to provide improved physical properties and produce exceptionally fine-grain and low-stress deposits

Circuposit™ 4000 Horizontal Electroless Copper

A self-accelerating electroless copper bath designed for use in the horizontal mode, and can be used in either high or low build applications

Circuposit™ 484 Black Oxide & Converter

A black oxide product that promotes innerlayer adhesion of copper in multi-layer circuit board fabrication

Circuposit™ Hole Prep 4126 Sweller

A solvent swell product designed to enhance the resin texturing and smear removal of high Tg materials in the subsequent Circuposit™ Promoter stage

Circuposit™ LC-9100 Electroless Copper Process

Eliminating the need for a separate accelerator step, saving space, increasing process speed, and improving reliability and quality


Copper Gleam™ CuPulse Plus PPR

Designed for use with periodic pulse reverse (PPR) plating

Copper Gleam™ HV-101 & HV-606 Electrolytic Copper

Delivering high plating efficiency to improve productivity and reduce cost


Duraposit™ Electroless Nickel & Aurolectroless™ Immersion Gold

Designed to lower board manufacturer's ENIG process costs, while maintaining optimum reliability and performance


Electroposit™ 1500 Acid Copper

Designed for reliable through-hole plating of printed circuit boards and used to plate boards with thickness up to approximately 5mm at high rates with excellent surface distribution, leveling and throwing power


Lithojet™ 223 Inkjet Resist

A UV-curable acrylic hybird ink that redefines the etching process for PCB innerlayer fabrication


Microfill™ EVF 15 Via Fill

Providing complete fill at lower copper thickness, reduced dimples and skip-rate, and improved surface appearance

Microfill™ EVF Via Fill

Providing enhanced microvia filling, with simultaneous through-hole plating capability, at previously unattainable surface thicknesses


Pallamerse™ SMT 2000 Electroless Palladium

Formulated for use in combination with Duraposit™ electroless nickel baths and Aurolectroless™ immersion gold baths to provide uniform ENEPIG deposits for final finishing of PCBs


Develop, Etch and Strip Imaging Products

A wide range of supporting products for developing, etching and stripping processes that compliment our photo imageable products

Photoposit™ Liquid Photoresist

Uniform thin coatings provide improved surface conformance, improved fine-line etching performance, as well as lower costs and reduced waste


Ronaclean™ EVP-210S Cleaner

Formulated to work with both vertical in-line and horizontal equipment used to fabricate HDI and IC Substrates


IC Substrates

Copper plating solutions for substrates in all types of advanced packages.

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Circuposit™ 4000 Horizontal Electroless Copper

A self-accelerating electroless copper bath designed for use in the horizontal mode, and can be used in either high or low build applications

Circuposit™ 6500 Electroless Copper Process

An Ionic Catalyst and a Tartrate-based Electroless copper that meet demands on interconnect density and reliability

Circuposit™ 7800 Vertical Desmear Process for SAP

Improving adhesion of the subsequent metal layer for next-generation dielectric materials

Circuposit™ 7900 Electroless Copper for SAP

Providing uniform copper deposits by ensuring even absorbtion catalyst on dielectric materials

Circuposit™ ADV 8550 Electroless Copper Process

A high throw electroless copper system that enables reliable coverage in microvias while minimizing surface copper deposits, thereby enhancing etching capability.


Duraposit™ Electroless Nickel & Aurolectroless™ Immersion Gold

Designed to lower board manufacturer's ENIG process costs, while maintaining optimum reliability and performance

Duraposit™ SMT-820 Electroless Nickel

A high phosphorous Electroless Nickel specifically formulated for use in combination with the Aurolectroless™ SMT 520 Immersion Gold process


Microfill™ EVF 15 Via Fill

Providing complete fill at lower copper thickness, reduced dimples and skip-rate, and improved surface appearance

Microfill™ EVF Via Fill

Providing enhanced microvia filling, with simultaneous through-hole plating capability, at previously unattainable surface thicknesses

Microfill™ LVF 3 Acid Copper

Offering excellent blind microvia fill with lower copper surface thickness

Microfill™ LVF IV Acid Copper

Offering excellent laser micro-via fill and pattern plate uniformity of flip-Chip substrates

Microfill™ THF-100 Electrolytic Copper Bath

Providing through hole fill of inner core layers for IC-Substrate PCB with improved reliability, and both electrical and thermal conductivity


Pallamerse™ SMT 2000 Electroless Palladium

Formulated for use in combination with Duraposit™ electroless nickel baths and Aurolectroless™ immersion gold baths to provide uniform ENEPIG deposits for final finishing of PCBs


Ronaclean™ EVP-210S Cleaner

Formulated to work with both vertical in-line and horizontal equipment used to fabricate HDI and IC Substrates


High Density Interconnect

Our highly conformal copper plating will enable any HDI design to perform well.

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Circubond™ 2200 Plus Innerlayer Bonding Process

Designed for both horizontal and vertical processing of innerlayers


Circuposit™ 3000-1 Electroless Copper

Formulated to provide improved physical properties and produce exceptionally fine-grain and low-stress deposits

Circuposit™ 4000 Horizontal Electroless Copper

A self-accelerating electroless copper bath designed for use in the horizontal mode, and can be used in either high or low build applications

Circuposit™ 484 Black Oxide & Converter

A black oxide product that promotes innerlayer adhesion of copper in multi-layer circuit board fabrication

Circuposit™ 6500 Electroless Copper Process

An Ionic Catalyst and a Tartrate-based Electroless copper that meet demands on interconnect density and reliability

Circuposit™ Hole Prep 4126 Sweller

A solvent swell product designed to enhance the resin texturing and smear removal of high Tg materials in the subsequent Circuposit™ Promoter stage


Copper Gleam ST-920 Acid Copper

Offering excellent through-hole throwing power combined with excellent conformal microvia plating

Copper Gleam™ HV-101 & HV-606 Electrolytic Copper

Delivering high plating efficiency to improve productivity and reduce cost


Duraposit™ Electroless Nickel & Aurolectroless™ Immersion Gold

Designed to lower board manufacturer's ENIG process costs, while maintaining optimum reliability and performance

Duraposit™ SMT-820 Electroless Nickel

A high phosphorous Electroless Nickel specifically formulated for use in combination with the Aurolectroless™ SMT 520 Immersion Gold process


Electroposit™ 1500 Acid Copper

Designed for reliable through-hole plating of printed circuit boards and used to plate boards with thickness up to approximately 5mm at high rates with excellent surface distribution, leveling and throwing power


Microfill™ EVF 15 Via Fill

Providing complete fill at lower copper thickness, reduced dimples and skip-rate, and improved surface appearance

Microfill™ EVF Via Fill

Providing enhanced microvia filling, with simultaneous through-hole plating capability, at previously unattainable surface thicknesses

Microfill™ LVF 3 Acid Copper

Offering excellent blind microvia fill with lower copper surface thickness

Microfill™ THF-100 Electrolytic Copper Bath

Providing through hole fill of inner core layers for IC-Substrate PCB with improved reliability, and both electrical and thermal conductivity


Ronaclean™ EVP-210S Cleaner

Formulated to work with both vertical in-line and horizontal equipment used to fabricate HDI and IC Substrates


Ronastan™ EC-1 NPE Free Electrolytic Tin

An acidic tin plating solution which produces smooth, fine-grained deposits over a wide plating range


Flexible Circuits

Copper plating to meet the demands of flexible PCBs.

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Circuposit™ 200 MLB Process

Designed to lower board manufacturer's ENIG process costs, while maintaining optimum reliability and performance

Circuposit™ 4000 Horizontal Electroless Copper

A self-accelerating electroless copper bath designed for use in the horizontal mode, and can be used in either high or low build applications


Conductron™ DP/DP-H Direct Plate Process

Processes especially designed for operation in vertical and horizontal equipment respectively


Copper Gleam™ HGX Electrolytic Copper Plate

Producing uniform crystal grain structure to provide a smooth plated surface on rolled copper

Copper Gleam™ HS-200 Electrolytic Copper

A patented 3-step desmear to effectively clean, condition and activate hole-wall surfaces


Duraposit™ Electroless Nickel & Aurolectroless™ Immersion Gold

Designed to lower board manufacturer's ENIG process costs, while maintaining optimum reliability and performance